Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 15-30 work days |
| Delivery Time | 15-30 work days |
| Packaging Details | 100mm x 87mm 699 pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | ODM 32G Nvidia Jetson Agx Xavier Industrial Module for Autonomous Vehicles |
| Keyword | ODM 32G Nvidia Jetson Agx Xavier Industrial Module for Autonomous Vehicles |
| AI Performance | 32 TOPS |
| GPU | NVIDIA Volta™ architecture with 512 NVIDIA CUDA cores and 64 Tensor cores |
| CPU | 8-Core Carmel ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3 |
| Memory | 32 GB 256-bit LPDDR4x 136.5GB/s |
| Storage | 32 GB eMMC 5.1 |
| DL Accelerator | 2x NVDLA 10 TOPS (INT8) |
| Vision Accelerator | 2x PVA |
| Power | 10W | 15W | 30W |
| Size | 100mm x 87mm |
| Brand Name | NVIDIA |
| Model Number | AGX xavier 32G (900-82888-0040-000) |
| Place of Origin | USA |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 15-30 work days |
| Delivery Time | 15-30 work days | Packaging Details | 100mm x 87mm 699 pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | ODM 32G Nvidia Jetson Agx Xavier Industrial Module for Autonomous Vehicles | Keyword | ODM 32G Nvidia Jetson Agx Xavier Industrial Module for Autonomous Vehicles |
| AI Performance | 32 TOPS | GPU | NVIDIA Volta™ architecture with 512 NVIDIA CUDA cores and 64 Tensor cores |
| CPU | 8-Core Carmel ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3 | Memory | 32 GB 256-bit LPDDR4x 136.5GB/s |
| Storage | 32 GB eMMC 5.1 | DL Accelerator | 2x NVDLA 10 TOPS (INT8) |
| Vision Accelerator | 2x PVA | Power | 10W | 15W | 30W |
| Size | 100mm x 87mm | Brand Name | NVIDIA |
| Model Number | AGX xavier 32G (900-82888-0040-000) | Place of Origin | USA |
| High Light | ODM nvidia jetson agx xavier industrial ，32G nvidia jetson agx xavier industrial ，ODM agx xavier module | ||
ODM 32G Nvidia Jetson Agx Xavier Industrial Module for Autonomous Vehicles
NVIDIA Jetson AGX Xavier Module
Volta GPU + Carmel CPU + 32GB LPDDR4x + 32GB eMMC
The NVIDIA Jetson AGX Xavier module blends industry leading performance, power efficiency, integrated deep learning capabilities and rich I/O to enable emerging technologies with compute- intensive requirements. Designed for applications converging on artificial intelligence (AI), computer vision (CV) and advanced graphics, the AGX Xavier series module is ideal for (but not limited to): Intelligent Video Analytics (IVA), Robotics, Virtual Reality (VR), Augmented Reality (AR) and Portable Medical Devices.
One End-to-End, Modular, and Scalable Platform
Autonomous vehicles (AV) powered by AI are changing the way we move people and goods all over the world.
NVIDIA Jetson AGX Xavier 32G Module Technical Specifications
| Shock | Non-operational: 340G, 2 ms, half sine, 6 shocks/axis, 3 axes |
| Vibration | Non-operational: 10-500 Hz, 5G RMS, 8 hours/axis |
| Temperature | Operational: -25°C to 80°C at TTP |
| Humidity | Non-operational: 95% RH, -10°C to 65°C, 10cycl/240 hours |
| Operating Lifetime | 5 Years |
| AI Performance | 32 TOPS (INT8) |
| GPU | NVIDIA Volta™ architecture with 512 NVIDIA CUDA® cores and 64 Tensor cores |
| CPU | 8-core NVIDIA Carmel Armv8.2 64-bit CPU 8MB L2 + 4MB L3 |
| DL Accelerator | 2x NVDLA 10 TOPS (INT8) |
| Vision Accelerator | 2x PVA |
| Memory | 32GB 256-bit LPDDR4x 136.5GB/s |
| Storage | 32 GB eMMC 5.1 |
| CSI Camera | Up to 6 cameras (36 via virtual channels) 16 lanes MIPI CSI-2, 8 lanes SLVS-EC D-PHY 1.2 (up to 40Gbps) C-PHY 1.1 (up to 62Gbps) |
| Video Encode | 4x 4K60 (H.265) 8x 4K30 (H.265) 16x 1080p60 (H.265) 32x 1080p30 (H.265) 30x1080p30 (H.264) |
| Video Decode | 2x 8K30 (H.265) 6x 4K60 (H.265) 12x 4K30 (H.265) 26x 1080p60 (H.265) 52x 1080p30 (H.265) 30x 1080p30 (H.264) |
| UPHY | 8x PCIe Gen4 | 8x SLVS-EC 3x USB 3.1 Single Lane UFS |
| Networking | 10/100/1000 BASE-T Ethernet |
| Display | Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b |
| Other I/O | USB 2.0 UART, SPI, CAN, I2C, I2S, DMIC & DSPK, GPIOs |
| Power | 10W | 15W | 30W |
| Mechanical | 100mm x 87mm 699 pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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