Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO |
| Color | Black |
| Temperature | 125°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining |
| Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | HN22010 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Shenzhen China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO | Color | Black |
| Temperature | 125°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining | Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack | Model Number | HN22010 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Shenzhen China |
| High Light | Heat Resistant Matrix Trays ，Electronic PCBA Parts Matrix Trays ，MPPO Jedec Matrix Trays | ||
Heat Resistant MPPO Black Matrix Trays For Electronic PCBA Parts
In the field of microelectronics, the international standards have been developed for the transportation, storage and protection of IC, modules and other electronic components, which usually refer to the JEDEC standard. The JEDEC (Joint Electron Device Engineering Council) tray is a common name for a standardized tray. According to the customer's different product size, the tray has different matrix design. It is usually injection molded to achieve high quality product requirements. At the same time, due to the particularity of this kind of plastic products, it can not only be reused many times, but also can be completely degraded after being damaged and discarded. The products fully comply with ROHS international environmental standards, customers do not have to worry about environmental protection.
The Details Of HN22010 Matrix Tray
HN22010 matrix tray has an outer size of 322.6*135.9*9.7mm, which is mainly made of MPPO material by injection molding. It is a widely used industrial raw material with high strength, high temperature resistance and environmental protection. According to the fixed pocket size, it is designed into the most reasonable 2*6 matrix. At the same time, the resistance value of the material surface is 1.0*10E4Ω~1.0*10E11Ω. It can effectively eliminate the static electricity on the surface of the product, so it is also known as the ESD tray in the industry.
In addition, we can also customize the tray for customers' products according to their requirements of size, color, high temperature resistance and so on. In addition to the matrix tray, we can also provide matching tray cover. The product is not only beautiful in appearance, but can do the most reasonable loading. It also can be overlap, which can effectively utilize space and increase product storage.
| Outline Line Size | 322.6*135.9*9.7mm | Brand | Hiner-pack |
| Model | HN22010 | Package Type | N/A |
| Cavity Size | 36.42*51.92*2.9mm | Matrix QTY | 2*6=12PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Original | China |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN22010 JEDEC Tray
Optical Industry Military Industry
Micro and Nano Systems Embedded System
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
Advantages
1.Flexible OEM service: we can produce products according to customer’s sample or design.
2.Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3.Complicated workmanship: tooling making, Injection molding,Production
4.Comprehensive customer service: from customer consultation to after sales service.
5.10 years experience of OEM for USA and EU customers.
6.We have our own factory and can control quality in high level and produce products quickly and flexibly.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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