Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Matrix QTY | 7*8=56PCS |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN22007 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Matrix QTY | 7*8=56PCS | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding | Brand Name | Hiner-pack |
| Model Number | HN22007 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA | ||
| High Light | 56PCS Waffle Pack Chip Trays ，2 Inch Waffle Pack Tray ，Black Waffle Pack Tray | ||
China Manufacturer Black PC 2 Inch Waffle Pack Chip Tray
In order to effectively protect the bare chip during transportation, it is very important to choose the right packaging. Because the products can be affected by a variety of factors during storage and transportation, including movement within the pocket, contact of the top surface, electrostatic discharge (ESD), and even exposure to the air. These conditions can damage the product, resulting in reduced the quality of production.
As the packaging specialists, Hiner-pack can help you choose the waffle pack that best meets your needs while protecting your bare chip from corrosion and ESD. The IC chip tray have been tested by ROHS and SGS and other third-party institutions. Before shipment, the quality department must confirm that the products are 100% qualified. For many years, our products have been sold to famous customers at home and abroad. Rich experience in injection molding industry can provides customers with the most suitable packaging solutions.
The Details Of The HN22007 Waffle Pack
The HN22007 Waffle pack is designed to provide clean, secure packaging for bare molds and other electronic chips. It also has a variety of functions such as bending resistance, bearing strength and high temperature resistance. The 7*8 matrix pocket design can also accommodate more customers' products. Customers choose the chip tray they want according to the size of the pocket. This is to avoid the device spinning or flipping in the pocket.
At the same time, we can provide professional customized services according to customer requirements. Customized trays of various sizes for customers to achieve the most reasonable loading. In addition, there are matching lid, clip,Tyvek paper for customers to choose. We are honored to bring excellent service to our customers.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN22007 | Package Type | Die |
| Cavity Size | 3.55*4.65*0.85 | Matrix QTY | 7*8=56PCS |
| Material | PC | HS Code | 3923900000 |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN22007 Waffle Pack Chip Tray
Electronic Component Semiconductor
Micro and Nano Systems Sensor IC
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" waffle pack feeder machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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