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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness
China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness

  1. China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness
  2. China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness
  3. China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness
  4. China Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness

Customized 4 Inch PC Stable Waffle Pack Chip Trays 0.3mm Flatness

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material PC
Color Black
Warpage less than 0.3mm
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN22028
Certification ISO 9001 ROHS SGS
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material PC Color Black
Warpage less than 0.3mm Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding Brand Name Hiner-pack
Model Number HN22028 Certification ISO 9001 ROHS SGS
Place of Origin CHINA
High Light 0.3mm Waffle Pack Chip TraysPC 4 Inch Waffle PackStable 4 Inch Waffle Pack

Customized 4 Inch PC Stable Waffle Pack Chip Tray 0.3 Flatness

 

The waffle pack serves as a carrier for semiconductor chip packaging, primarily utilized for safeguarding, storing and transporting. In comparison to conventional packaging, it is capable of accommodating smaller products while also providing anti-impact and anti-static functionalities. This makes it highly suitable for modern production and transportation needs. Additionally, the tray can be reused multiple times and the product can be fully degraded in case of damage. All products are compliant with ROHS international environmental standards.

 

The Details of the HN22028 Waffle Pack

 

The HN22028 waffle pack is specifically designed to provide customers with clean and secure packaging for their products during transportation. Made primarily of PC, this material offers excellent stability and protection for electronic items. Additionally, customers can select the appropriate tray size to prevent product movement or displacement within the package.

 

To further meet storage needs, we offer a range of matching lids, clamps, and Tyvek paper options. The waffle packs are loaded utilizing pick and place equipment to ensure that each pocket's interior accommodates a part or component. Once loaded, the parts are shielded with tyvek paper before being secured in place by a lid, and finally matching clamps hold them firmly together.

 

Product Application

 

Aerospace Industry           Electronic Component

Embedded System            Micro and Anon System

 

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages

 

1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.

 

FAQ

 

Q1: Are you a manufacturer or a trading company?

Ans: We are a 100% specialized manufacturer in packaging for over 10 years, with a workshop area of 1500 square meters located in Shenzhen, China.

Q2: What materials do your products use?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you assist with design?

Yes, we can accept customization and package according to your requirements.

Q4: May I request some samples prior to placing a bulk order? Yes, we can provide free samples from our stock, however, the shipping fee will be at your expense.

Q5: Would it be possible for you to incorporate my logo into the product? Certainly, we are able to customize the product with your logo. Kindly show us your logo first.

Q6: When can we expect to receive the samples? If you express interest in any of our stocked items, we can send them out immediately.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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