Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 80~100pcs/carton |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Tray Weight | 120~200g |
| Surface Resistance | 1.0*10e4-1.0*10e11Ω |
| Material | MPPO.PPE.ABS.PEI.IDP |
| Tray Features | Stackable |
| Application | IC Packaging |
| Color | Black |
| Tray Shape | Rectangular |
| Height | 7.62mm |
| Brand Name | Hiner-pack |
| Model Number | JEDEC TRAY SERIES |
| Place of Origin | China |
| Certification | ISO 9001 SGS ROHS |
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Product Specification
| Packaging Details | 80~100pcs/carton | Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
| Tray Weight | 120~200g | Surface Resistance | 1.0*10e4-1.0*10e11Ω |
| Material | MPPO.PPE.ABS.PEI.IDP | Tray Features | Stackable |
| Application | IC Packaging | Color | Black |
| Tray Shape | Rectangular | Height | 7.62mm |
| Brand Name | Hiner-pack | Model Number | JEDEC TRAY SERIES |
| Place of Origin | China | Certification | ISO 9001 SGS ROHS |
| High Light | Universal JEDEC Matrix Tray ，JEDEC Matrix Tray For IC Packaging ，Stackable JEDEC Standard Matrix Tray | ||
Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs.
This JEDEC matrix tray is crafted for precision and efficiency in electronics component handling, designed to meet the rigorous demands of high-speed, high-accuracy manufacturing environments. With a structure optimized for automated workflows, it supports reliable component presentation, safe transport, and repeatable loading/unloading operations. The tray offers robust protection for fragile parts while ensuring compatibility with a wide range of industry-standard equipment. Its design enables consistent performance during repetitive cycles in automated systems, making it ideal for modern production lines.
• JEDEC Standard Compliance: Fully aligns with industry standards to ensure seamless interoperability with global automation and inspection systems.
• Stable ESD Protection: The conductive polymer structure safeguards sensitive components from electrostatic discharge during all handling stages.
• Accurate Part Containment: Uniform pocket alignment reduces misplacement risks and promotes precise positioning in pick-and-place operations.
• Automated Equipment Compatibility: Built-in structural cues support vacuum pickup systems, stackers, conveyors, and robotic arms.
• Reliable Stack Integration: Interlocking edges ensure trays remain aligned during vertical stacking, improving safety in both storage and transit.
• Consistent Mechanical Strength: Resists warping and deformation over time, even under repeated handling or exposure to standard processing conditions.
Reference to the temperature resistance of different materials with the JEDEC Tray:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized | ||
Ideal for use across semiconductor and electronics production lines, this tray is well-suited to component test handling, automated device programming, and SMT assembly operations. It supports workflows where parts must remain stable, aligned, and protected through various stages of production, inspection, or shipping. This includes IC packaging, module assembly, and small part transport, making it a dependable tool in both volume manufacturing and specialized applications.
Engineered for flexibility, the tray can be adapted to support specific use cases and customer preferences:
• Custom Pocket Geometry: Modify layout or structure to match unusual part shapes or special device handling needs.
• ESD-Safe Color Variants: Utilize custom-colored conductive materials for production zone coding or inventory tracking.
• Molded Feature Integration: Incorporate customer-specific indicators, serial codes, or version marks directly into the tray body.
• Enhanced Handling Features: Add or adjust physical features to better align with proprietary robotic tooling, gripping systems, or test equipment.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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