Packaging Details | 80~100pcs/carton |
Delivery Time | 1~2 Weeks |
Payment Terms | 100% Prepayment |
Supply Ability | 2000PCS/Day |
Application | IC Packaging |
Tray Weight | 120~200g |
Tray Features | Stackable |
Material | MPPO.PPE.ABS.PEI.IDP |
Tray Shape | Rectangular |
IC Type | BGA,QFP,QFN,LGA,PGA |
Height | 7.62mm |
Size | 322.6*135.9mm |
Brand Name | Hiner-pack |
Model Number | JEDEC TRAY SERIES |
Place of Origin | CHINA |
Certification | ISO 9001 SGS ROHS |
View Detail Information
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Product Specification
Packaging Details | 80~100pcs/carton | Delivery Time | 1~2 Weeks |
Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
Application | IC Packaging | Tray Weight | 120~200g |
Tray Features | Stackable | Material | MPPO.PPE.ABS.PEI.IDP |
Tray Shape | Rectangular | IC Type | BGA,QFP,QFN,LGA,PGA |
Height | 7.62mm | Size | 322.6*135.9mm |
Brand Name | Hiner-pack | Model Number | JEDEC TRAY SERIES |
Place of Origin | CHINA | Certification | ISO 9001 SGS ROHS |
High Light | LGA IC JEDEC Trays ,PGA IC JEDEC Trays ,QFN IC JEDEC Trays |
Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standards.
JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low-profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC.
• Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. For many decades of history and wide and far application, there have been many products to support JEDEC matrix trays.
• Packaging – At the heart of it all, the JEDEC matrix trays serve as containers. The outline of the JEDEC matrix trays comes with stacking capabilities, with the top tray locking the bottom one in place.
• Transportation & Storage – Parts that are kept inside the stacked JEDEC matrix trays are simple to keep or transport everywhere, be it several steps away or even cross-country. Moreover, JEDEC matrix trays also double up as “boats” during industrial processes, as they can hold the parts in transit through various process equipment.
• Protection – Contained parts inside the JEDEC matrix trays are protected from mechanical damage. Moreover, most of the JEDEC matrix trays are manufactured with a material that is able to ward off ESD damage.
Reference to the temperature resistance of different materials with the JEDEC Tray:
Material | Bake Temperature | Surface Resistance |
PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
Color, temperature, and other special requirements can be customized |
They can be used to hold a variety of components, such as semiconductors, electronic components, optical and photonic products, and purely mechanical parts. Generally, they are built with ESD-safe engineering plastic to prevent static electricity discharges.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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