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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC
China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC

  1. China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC
  2. China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC
  3. China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC
  4. China BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC

  1. MOQ: 1000 pcs
  2. Price: TBC
  3. Get Latest Price
Packaging Details 80~100pcs/carton
Delivery Time 1~2 Weeks
Payment Terms 100% Prepayment
Supply Ability 2000PCS/Day
Application IC Packaging
Tray Weight 120~200g
Tray Features Stackable
Material MPPO.PPE.ABS.PEI.IDP
Tray Shape Rectangular
IC Type BGA,QFP,QFN,LGA,PGA
Height 7.62mm
Size 322.6*135.9mm
Brand Name Hiner-pack
Model Number JEDEC TRAY SERIES
Place of Origin CHINA
Certification ISO 9001 SGS ROHS

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details 80~100pcs/carton Delivery Time 1~2 Weeks
Payment Terms 100% Prepayment Supply Ability 2000PCS/Day
Application IC Packaging Tray Weight 120~200g
Tray Features Stackable Material MPPO.PPE.ABS.PEI.IDP
Tray Shape Rectangular IC Type BGA,QFP,QFN,LGA,PGA
Height 7.62mm Size 322.6*135.9mm
Brand Name Hiner-pack Model Number JEDEC TRAY SERIES
Place of Origin CHINA Certification ISO 9001 SGS ROHS
High Light LGA IC JEDEC TraysPGA IC JEDEC TraysQFN IC JEDEC Trays

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standards.


JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low-profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC.

Features:

• Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. For many decades of history and wide and far application, there have been many products to support JEDEC matrix trays.

• Packaging – At the heart of it all, the JEDEC matrix trays serve as containers. The outline of the JEDEC matrix trays comes with stacking capabilities, with the top tray locking the bottom one in place.

• Transportation & Storage – Parts that are kept inside the stacked JEDEC matrix trays are simple to keep or transport everywhere, be it several steps away or even cross-country. Moreover, JEDEC matrix trays also double up as “boats” during industrial processes, as they can hold the parts in transit through various process equipment.

• Protection – Contained parts inside the JEDEC matrix trays are protected from mechanical damage. Moreover, most of the JEDEC matrix trays are manufactured with a material that is able to ward off ESD damage.


Reference to the temperature resistance of different materials with the JEDEC Tray:

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature, and other special requirements can be customized

Applications:

JEDEC Matrix Trays are designed to protect and accurately hold parts in an automated environment. This makes them ideal for companies that utilize pick and place automation systems and standardized process equipment. Not only that, they simplify automation programming tasks with their well-defined component pattern.

They can be used to hold a variety of components, such as semiconductors, electronic components, optical and photonic products, and purely mechanical parts. Generally, they are built with ESD-safe engineering plastic to prevent static electricity discharges.



Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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