Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 80~100pcs/carton |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| IC Type | BGA,QFP,QFN,LGA,PGA |
| Size | 322.6*135.9mm |
| Surface Resistance | 1.0*10e4-1.0*10e11Ω |
| Tray Shape | Rectangular |
| Tray Weight | 120~200g |
| Application | IC Packaging |
| Color | Black |
| Height | 7.62mm |
| Brand Name | Hiner-pack |
| Model Number | JEDEC TRAY SERIES |
| Place of Origin | China |
| Certification | ISO 9001 SGS ROHS |
View Detail Information
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Product Specification
| Packaging Details | 80~100pcs/carton | Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
| IC Type | BGA,QFP,QFN,LGA,PGA | Size | 322.6*135.9mm |
| Surface Resistance | 1.0*10e4-1.0*10e11Ω | Tray Shape | Rectangular |
| Tray Weight | 120~200g | Application | IC Packaging |
| Color | Black | Height | 7.62mm |
| Brand Name | Hiner-pack | Model Number | JEDEC TRAY SERIES |
| Place of Origin | China | Certification | ISO 9001 SGS ROHS |
| High Light | PEI JEDEC IC Trays ，BGA IC JEDEC Trays ，7.62mm JEDEC Trays | ||
JEDEC matrix trays all have the same basic measurements: 12.7 inches wide by 5.35 inches long (322.6 x 136mm). Low profile trays, which have a thickness of 0.25 inches (6.35mm), can contain up to 90% of all the standard components such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC.
Standardization – Being compatible with most semiconductor manufacturing equipment, JEDEC IC matrix trays have decades of history and familiarity with support products that are spread globally.
Packaging – As containers, JEDEC matrix trays include features for stacking, which makes them cover each other when being placed one above the other.
Transportation & Storage – Trays loaded with parts are easy for storage and transportation while functioning as process “boats”, holding the parts through different operations.
Protection – Not only shielding the parts inside against mechanical damage, most JEDEC matrix trays are also equipped to protect the items against electrostatic discharge (ESD) damage.
JEDEC Matrix Trays are ideal for providing precision handling and protection for parts in automated environments. Components positioned in a definitive pattern make for greater automation and easier programming. This kind of tray is widely used for a variety of products, such as semiconductors, electronics, optical and photonics, and even for mechanical parts. Notably, their usage in pick and place automation, and the use of standardized process equipment also leads to increased reliance on JEDEC Matrix Trays.
Further, the majority of JEDEC Matrix Trays are constructed from ESD-safe engineering plastic, making them even more reliable and secure. Companies that require precision and protection rely on the strength and convenience of the JEDEC Matrix Tray.
Introducing Hiner-pack's JEDEC Tray Series, the apple tray making machine made in China that is built to ISO 9001 SGS ROHS standards and is available in a minimum order quantity of 500. The trays come packaged 80~100pcs/carton and have a delivery time of 1~2 Weeks with payment terms of 100% Prepayment. This tray making machine is capable of producing 2000PCS/Day with a material of MPPO.PPE.ABS.PEI.IDP and a weight of 120~200g, and has a surface resistance of 1.0*10e4-1.0*10e11Ω with a black color. It is suitable for IC types such as BGA,QFP,QFN,LGA,PGA.
Hiner-pack provides customizing service for its JEDEC IC Trays.
Product Description:
Our JEDEC IC Trays are great for Electronic Components IC Chips, Core Tray Racking, Electronic Components IC Chips Tray.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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