Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~7 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE |
| Color | Black |
| Temperature | 150°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| OEM&ODM | Accept |
| Mold Type | Injection |
| Brand Name | Hiner-pack |
| Model Number | HN21061 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~7 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE | Color | Black |
| Temperature | 150°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| OEM&ODM | Accept | Mold Type | Injection |
| Brand Name | Hiner-pack | Model Number | HN21061 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | ESD JEDEC Tray ，Black ESD JEDEC Tray ，ROHS JEDEC IC Trays | ||
ROHS Black ESD JEDEC Tray High Temperature Resistant For LGA IC Chips
High temperature resistant and antistatic IC JEDEC tray
Detail Description:
| Outline Line Size | 322.6*135.9*8.5mm | Brand | Hiner-pack |
| Model | HN 21061 | IC Package Type | LGA |
| Cavity Size | 20.2*20.2*3.35mm | Matrix QTY | 5*12=60PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
All Jedc matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN... And so on.
Location of Filler Pockets for Vacuum Chuck
The filler pockets for vacuum chuck shall be formed as follows:
(1) One at the center of the tray and one on each end, as located in Tables 2 and 3.
(2) The center filler pocket shall be 32 x 32 mm at least.
JEDEC tray is compatible with JEDEC tray feeder, reducing manual handling and loading and other processes, providing a complete automation service for efficient production, realizing automatic picking during assembly, avoiding damage to chips and avoiding manual picking and chip oxidation.
Product Application
Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
Advantage
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years experience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
Anti-static tray is an ideal tool for storing electronic components. It is made of special polymer chains added in the raw materials, so it has permanent electrostatic dissipation performance.Anti-static tray has good mechanical strength and heat resistance, good impact strength, strong chemical corrosion resistance, and will not change its anti-static performance due to the environment, time and temperature.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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