Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Property | ESD |
| Design | Standard |
| Size | 2 Inch |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Use | Transport, Storage, Packing |
| Brand Name | Hiner-pack |
| Model Number | HN20005 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Property | ESD | Design | Standard |
| Size | 2 Inch | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Use | Transport, Storage, Packing |
| Brand Name | Hiner-pack | Model Number | HN20005 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | OEM Bare Die Trays ，2Inch Bare Die Trays ，ODM Bare Die Tray | ||
Stackable, reusable, and automation-ready—our chip trays are built for semiconductor production lines.
High-temperature resistance waffle pack tray is specifically designed to support semiconductor and microelectronic components during thermal processes such as solder reflow, die attach curing, and burn-in testing. Constructed from advanced bakeable plastic compounds, the tray maintains structural integrity and dimensional stability at elevated temperatures. Its 2x2 inch footprint and precision-molded pocket layout are ideal for flat or semi-flat components like CSPs, bare die, and passive devices. The tray offers reliable protection and orientation throughout high-temperature workflows while being fully compatible with automation equipment, including pick-and-place arms and tray shuttling systems.
1. More than 12 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The factory has ISO certification, and the products comply with the RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service or cost performance being well recognized.
Wafer Die / Bare / Chips; PCBA module component; Electronic component packaging; Optical device packaging
| Brand | Hiner-pack | Outline Line Size | 50.7*50.7*4mm |
| Model | HN20005 | Cavity Size | 0.5*0.8*0.15 mm |
| Package Type | Die | Matrix QTY | 20*25=500PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS/SGS |
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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