Payment Terms | T/T |
Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
Delivery Time | 5~8 working days |
Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm |
Material | MPPO.PPE.ABS.PEI.IDP...etc |
Color | Black.Red.Yellow.Green.White..etc |
Temperature | 80°C~180°C |
Property | ESD,Non-ESD |
Surface resistance | 1.0x10E4~1.0x10E11Ω |
Flatness | less than 0.76mm |
Customized service | Support standard and non-standard,precision machining |
Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
Brand Name | Hiner-pack |
Model Number | JEDEC standard tray 322.6*135.9*7.62&12.19mm |
Certification | ISO 9001 ROHS SGS |
Place of Origin | Made In China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm |
Material | MPPO.PPE.ABS.PEI.IDP...etc | Color | Black.Red.Yellow.Green.White..etc |
Temperature | 80°C~180°C | Property | ESD,Non-ESD |
Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
Customized service | Support standard and non-standard,precision machining | Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
Brand Name | Hiner-pack | Model Number | JEDEC standard tray 322.6*135.9*7.62&12.19mm |
Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
High Light | Anti Static JEDEC IC Trays ,ABS JEDEC IC Trays ,JEDEC ic chip tray |
The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.
The Flat cells in the center area of each tray are designed for automatic equipment to allow the use of vacuum picking up tools. If it is necessary to cancel in special cases, we can also change the design according to your requirements at the beginning of the design.
The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP etc. We can provide custom service for all packaging methods of the chip tray.
Material | Bake Temperature | Surface Resistance |
PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
Color, temperature, and other special requirements can be customized |
FAQ:
1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.
2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.
3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW,FOB,CIF,DDU,DDP, etc. You can choose the one that is the most convenient or cost-effective for you.
5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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