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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray
China Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray

  1. China Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray
  2. China Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray
  3. China Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray

Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray

  1. MOQ: 1000 pcs
  2. Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 2500PCS~3000PCS/per day
Delivery Time 5~8 working days
Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm
Material MPPO.PPE.ABS.PEI.IDP...etc
Color Black.Red.Yellow.Green.White..etc
Temperature 80°C~180°C
Property ESD,Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω
Flatness less than 0.76mm
Customized service Support standard and non-standard,precision machining
Injection mold Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
Brand Name Hiner-pack
Model Number JEDEC standard tray 322.6*135.9*7.62&12.19mm
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 2500PCS~3000PCS/per day
Delivery Time 5~8 working days Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30mm
Material MPPO.PPE.ABS.PEI.IDP...etc Color Black.Red.Yellow.Green.White..etc
Temperature 80°C~180°C Property ESD,Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω Flatness less than 0.76mm
Customized service Support standard and non-standard,precision machining Injection mold Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
Brand Name Hiner-pack Model Number JEDEC standard tray 322.6*135.9*7.62&12.19mm
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light Anti Static JEDEC IC TraysABS JEDEC IC TraysJEDEC ic chip tray
Heat Resistant Anti-Static JEDEC IC Trays Electronic Components Tray
Engineered for precision and protection, our JEDEC trays ensure safe handling of sensitive IC components across every stage of production.

1. Standard JEDEC Tray Outline size is 322.6 X 135.9 X 7.62 mm or 322.6*135.9*12.19mm.
2. The production process involves injection-molded products.
3. Rich experience and mature design team in the field of injection molding products, providing one-stop services from design to mold to product packaging.

 

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.

 

The Flat cells in the center area of each tray are designed for automatic equipment to allow the use of vacuum picking up tools. If it is necessary to cancel in special cases, we can also change the design according to your requirements at the beginning of the design.

 

The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.

 

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP etc. We can provide custom service for all packaging methods of the chip tray.

Technical Parameters:

Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature, and other special requirements can be customized

 


FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW,FOB,CIF,DDU,DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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