Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO |
| Color | Black |
| Temperature | 125°C |
| Property | ESD, Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | Less than 0.76mm |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Use | Transport, Storage, Packing |
| Brand Name | Hiner-pack |
| Model Number | JEDEC standard tray 322.6*135.9*7.62&12.19mm |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
Explore similar products
Customized Matrix Socket Electronic Component Tray 88PCS Anti Static
Permanent Antistatic JEDEC Matrix Trays For Transport IC Component
Transport IC Components Injection JEDEC Standard Trays With Big Pocket Size
High Temperature Resistant JEDEC Matrix Trays Transport RF IC
Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO | Color | Black |
| Temperature | 125°C | Property | ESD, Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | Less than 0.76mm |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Use | Transport, Storage, Packing | Brand Name | Hiner-pack |
| Model Number | JEDEC standard tray 322.6*135.9*7.62&12.19mm | Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China | ||
| High Light | MPPO ESD Component Tray ，BGA ESD Component Tray ，BGA esd tray | ||
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.
Electronic component; Semiconductor; Embedded System; Display technology; Micro and Nano systems; Sensor; Test and Measurement Technology; Electromechanical equipment and systems; Power supply
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN1890 | Cavity Size | 6*8*1mm |
| Package Type | BGA IC | Matrix QTY | 24*16=384PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Reference to the temperature resistance of different materials:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized | ||
Q1: Are you a manufacturer?
Ans: Yes, we have an ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Ans: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!