Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc |
| Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C |
| Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts |
| Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | Outline Size 2inch 3Inch 4Inch |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc | Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C | Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts | Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack | Model Number | Outline Size 2inch 3Inch 4Inch |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | MPPO Waffle Pack Chip Trays ，ODM Waffle Pack Chip Trays ，MPPO waffle tray | ||
Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die
Looking for reliable IC packaging solutions? Discover our anti-static JEDEC trays tailored to your specific semiconductor designs.
Silicon dies can be delivered in a tray, which is also known as a waffle pack – a plastic tray with pockets that match the die size. A waffle pack has a lid and is delivered in an antistatic bag. Waffle packs are ideal for delivering a small number of silicon dies, typically from an MPW process.
Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded, the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized, Provide one-stop service from design to production to packaging.
Wafer Die / Bar / Chips and PCBA module component
Electronic component packaging, optical device packaging
1. More than 12 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The factory has ISO certification, and the products comply with the RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized.
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to the different product values. And all samples shipping costs are normally collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you help ship the goods?
A: By sea, by air, by express, by mail, post according to customer order quantity and volume.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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