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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China ABS Black Waffle Pack Chip Trays
China ABS Black Waffle Pack Chip Trays

  1. China ABS Black Waffle Pack Chip Trays
  2. China ABS Black Waffle Pack Chip Trays
  3. China ABS Black Waffle Pack Chip Trays
  4. China ABS Black Waffle Pack Chip Trays

ABS Black Waffle Pack Chip Trays

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C
Property ESD,Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω
Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Customized service Suitable for all kinds of Bar.Die.Chip devices or parts
Injection mold Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.)
Brand Name Hiner-pack
Model Number Outline Size 2inch 3Inch 4Inch
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS.PC.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Temperature General 80°C~100°C Property ESD,Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω Warpage less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Customized service Suitable for all kinds of Bar.Die.Chip devices or parts Injection mold Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.)
Brand Name Hiner-pack Model Number Outline Size 2inch 3Inch 4Inch
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light Waffle Pack Chip TraysABS Waffle Pack Chip TraysABS waffle pack trays
ABS Black Waffle Pack Chip Trays
Square Regular Antistatic ABS Waffle Pack With Different Cavity Can Be Designed For IC Chips


Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.


As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

Features:

1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix

Application:

Wafer Die / Bar / Chips / PCBA module component
Electronic component packaging and optical device packaging

Advantages:

1. More than 10 years of export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized

Technical Parameters:

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products



FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post according to customer order qty and volume.


Die Place On The Waffle Pack:

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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