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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging
China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

  1. China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging
  2. China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging
  3. China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging
  4. China ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS, PC, MPPO...etc.
Color Black, Red, Yellow, Green, White, etc.
Temperature General 80°C~100°C
Property ESD, Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω
Warpage Less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning
Incoterms EXW, FOB, CIF, DDU, DDP
Customized service Suitable for all kinds of Bar Die, Chip devices or parts
Injection mold Customized case need (Lead time 20~25Days, Mold Life Span: 450,000 times)
Brand Name Hiner-pack
Model Number HN21014-2
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 4500~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Material ABS, PC, MPPO...etc. Color Black, Red, Yellow, Green, White, etc.
Temperature General 80°C~100°C Property ESD, Non-ESD
Surface resistance 1.0x10E4~1.0x10E11Ω Warpage Less than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class General and ultrasonic cleaning Incoterms EXW, FOB, CIF, DDU, DDP
Customized service Suitable for all kinds of Bar Die, Chip devices or parts Injection mold Customized case need (Lead time 20~25Days, Mold Life Span: 450,000 times)
Brand Name Hiner-pack Model Number HN21014-2
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light Waffle Pack Bare Die TrayMPPO Bare Die TrayBare Die waffle tray

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

Our waffle packs meet demanding semiconductor transport requirements with customizable layout, depth, and cavity count.


To better protect the components or chips, choosing injection trays for packaging has become an alternative and an option for a packaging solution. It can not only provide comprehensive protection for components, but also provide excellent products in terms of storage and transportation. The great advantage of convenience. At the same time, due to the reusable characteristics of plastic pallets, the products we produce can also be reused, and the waste of plastic after disposal can also be fully degraded, thereby eliminating some of the problems that need to be dealt with by environmental protection. Our company can provide one-stop service from design to production to packaging, solve all the problems faced by packaging for your parts, choose high-quality professional suppliers, and reduce unnecessary after-sales troubles for you.


Waffle Pack (IC Chip Tray), usually used for loading small chips or components less than 13mm, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip, and Tyvek paper of the existing series, and the complete package is easier to transfer, transport, and store the products.

Application:

Wafer Die / Bar / Chips, PCBA module component, component packaging, Optical device packaging.

Advantages:

1. Flexible OEM service: We can produce products according to the customer’s sample or design.

2. Various Materials: The material can be MPPO, PPE, ABS, PEI, IDP, etc.

3. Complicated workmanship: tooling making, Injection molding, Production.

4. Comprehensive customer service: from customer consultation to after-sales service.

5. 12 years of experience in OEM for USA and EU customers.

6. We have our factory and can control quality at a high level and produce products quickly and flexibly.

Technical Parameters:

Brand Hiner-pack Outline Line Size 101.57*101.57*3mm
Model HN21014-2 Package Type IC Parts
Cavity Size 13*13mm Matrix QTY 6*6=36PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS


Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM, ODM TBC Customizable
Provide professional design and packaging for your products

waffle pack ic chip tray HN21014-1

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, by mail post according to customer order quantity and volume.

waffle pack ic chip tray HN21014-2

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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