Payment Terms | T/T |
Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
Delivery Time | 5~8 working days |
Packaging Details | It depends on the QTY of order and size of product |
Material | PC |
Color | Black |
Property | ESD |
Design | Standard |
Size | 4 Inch |
Surface Resistance | 1.0x10E4~1.0x10E11Ω |
Clean class | General And Ultrasonic Cleaning |
Use | Transport,Storage,Packing |
Brand Name | Hiner-pack |
Model Number | HN21016 |
Certification | ISO 9001 ROHS SGS |
Place of Origin | Made In China |
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Product Specification
Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
Material | PC | Color | Black |
Property | ESD | Design | Standard |
Size | 4 Inch | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
Clean class | General And Ultrasonic Cleaning | Use | Transport,Storage,Packing |
Brand Name | Hiner-pack | Model Number | HN21016 |
Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
High Light | ESD Waffle Pack Chip Trays ,ISO Waffle Pack Chip Trays ,Waffle esd plastic trays |
Customized high-temperature resistant Waffle Pack for carrying tiny modules
Hiner-pack production IC tray is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.
• Able to present non-standard components to the Pick and Place machines.
• Multiple uses for the fixture include component bake-out, storage, and shipping.
• Cost-effective alternative to “tape and reel” or “hand” placement.
1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transferring or loading samples for testing
3. Stable anti-static performance, a good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, with no environmental concerns
7. It can be stackable and can also ensure the design of maximum utilization of the tray matrix
• Wafer Die / Bar / Chips
• PCBA module component
• Electronic component packaging
• Optical device packaging
HN21016 Technical Data Ref. | ||||
Base Information | Material | Color | Matrix QTY | Pocket Size |
PC | Black | 9*7=63PCS | 6.62*8.29*0.8mm | |
Size | Length * Width * Height (according to the customer's requirement) | |||
Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
Sample | A. The free samples: Chosen from existing products. | |||
B. Customized samples as per your design/demand | ||||
Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
Artowrk Format | PDF,2D,3D |
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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