Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 4500~5000pcs/per day |
| Delivery Time | 6~8 working days |
| Packaging Details | It depends on the QTY of order（500PCS/20KG/50*40*30CM） |
| Material | PC |
| Temperature | 60~80°C |
| Accessories | Cover & Clip |
| Color | Black |
| Matrix QTY | 20X20=400PCS |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean Class | General And Ultrasonic Cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Brand Name | Hiner-pack |
| Model Number | HN21064 |
| Certification | ROHS SGS |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 4500~5000pcs/per day |
| Delivery Time | 6~8 working days | Packaging Details | It depends on the QTY of order（500PCS/20KG/50*40*30CM） |
| Material | PC | Temperature | 60~80°C |
| Accessories | Cover & Clip | Color | Black |
| Matrix QTY | 20X20=400PCS | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean Class | General And Ultrasonic Cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Brand Name | Hiner-pack | Model Number | HN21064 |
| Certification | ROHS SGS | Place of Origin | CHINA |
| High Light | OEM Waffle Pack Chip Trays ，PC Waffle Pack Chip Trays ，OEM waffle pack tray | ||
OEM Black Waffle Pack Chip Trays Match Automation Equipment
Waffle Pack Series Products Can Match Automation Equipment
Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and size, we from the design drawings, mold manufacturing, product manufacturing to cleaning packing and so on, all of the steps and operations through strict quality control, to deliver the ultimate goal of customer satisfaction for product, continuously meet the customer's requirements, To promote our factory to a higher level of progress.
Service
We offer ESD total Solution to Customer, Many other related product available if needed.
OEM is welcomed or design as customer request.
The best & professional sale services.
Honest but competitive price and Quality assured quotation.
100% QC inspection before shipment.
| Outline Line Size | 101.6*101.6*5.4mm | Brand | Hiner-pack |
| Model | HN21056 | Package Type | N/A |
| Cavity Size | 2.67*2.67*1.74mm | Matrix QTY | 18*18=324PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of ESD Tray
1. Semiconductor
2. Electronic component factories
3. SMT Surfacing factories
4. Optical industry
5. Military Industry
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time.
For more information, please contact our sales department
Hiner-Pack 4 Inch Waffle Pack Catalogue.pdf
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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