Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | PC |
| Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C |
| Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts |
| Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | HN21077 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | PC | Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C | Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts | Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack | Model Number | HN21077 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | Wafer Die Waffle Pack Tray ，4 Inch Waffle Pack Tray ，Wafer Die Waffle Pack Chip Trays | ||
Custom-engineered waffle packs reduce die shift, improve pick accuracy, and protect fragile chips throughout the supply chain.
Hiner-pack production IC tray waffle pack is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.
It is by virtue of an excellent professional team and unremitting efforts that Hiner-pack has been widely recognized by customers in the field of semiconductor materials. We take quality as the basis of survival and development, cooperate with customers and partners, long-term development, committed to become the semiconductor industry manufacturing and process materials in the world's leading service providers.
Waffle Pack is usually used to carry smaller chips or components, and the product can be matched with the cover plate, clip, Tyvek paper, and other corresponding accessories. Our company provides complete packaging services to ensure the safety of customers' product transfer, transportation, and storage.
| Brand | Hiner-pack | Outline Line Size | 101.6*101.6*4.5mm |
| Model | HN21077 | Cavity Size | 13.2*1.2*0.32mm |
| Package Type | IC Parts | Matrix QTY | 26*5=130PCS |
| Material | PC | Flatness | MAX 0.1mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Wafer Die / Bar / Chips; PCBA module component; Electronic component packaging; Optical device packaging
1. We have sample stock, which can also help the client to choose which type is suitable for them.
2. We will reply to you at any time if you have questions.
3. Choose a suitable product for clients according to the clients' requirements.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before production.
Q1: Are You a Manufacturer or a Trade Company?
A: We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2. Can I order if the quantity is less than the MOQ?
A: Yes, and it would be taken as a sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
A: Yes, if the samples we have in stock are provided for testing, but the shipment should be at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise on chip, quantity, and any other details required. Thank you.
Q4. Do you arrange shipments for the products?
A: It depends on our Incoterms. If the FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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