Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPO |
| Color | Black |
| Temperature | 150°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| Use | Transport,Storage,Packing |
| HS Code | 39239000 |
| Brand Name | Hiner-pack |
| Model Number | HN21075 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPO | Color | Black |
| Temperature | 150°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| Use | Transport,Storage,Packing | HS Code | 39239000 |
| Brand Name | Hiner-pack | Model Number | HN21075 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | PPO JEDEC Matrix Trays ，IC Packaging JEDEC Matrix Trays ，7.62mm Flatness JEDEC Matrix Trays | ||
Customized JEDEC Outline Matrix Trays for IC Packaging ESD 7.62mm Flatness
Our company will select JEDEC outline matrix trays for your IC and ensure compatibility with standardized semiconductor automation processes, test equipment and process tools. Not only that, we can also choose a different tray profile to better suit your process and equipment. Either way, you'll get professional advice and support. JEDEC tray are ideal for transportation and storage of ic chip because they are stackable, secure,. Most IC matrix trays are device-specific, with details optimized for the exact shape, size, and terminal style of the IC package.Although the packaging of BGA, CGA and PGA has many similarities, they all have different pallets. We know how to make a great tray.
1.Details about The HN21075 JEDEC Matrix Tray
All JEDEC matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN and so on.Our company's professional team offers custom IC matrix trays in JEDEC outlines , and with short lead times. For high volumes and special tray outlines, a custom molded tray may be the best option for your integrated circuits, MEMS, or multichip modules. We help you choose the right tray for your ic packaging.
| Outline Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN21076 | Package Type | N/A |
| Cavity Size | 51.45*35.45*3.29mm | Matrix QTY | 3*5=15PCS |
| Material | PPO | Flatness | MAX 0.1mm |
| Color | Black(can be customized) | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
2.Product Application
Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Reference to temperature resistance of different materials
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
.FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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