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Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning
China Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning

  1. China Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning
  2. China Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning
  3. China Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning

Black PC Waffle Pack Chip Tray General And Ultrasonic Cleaning

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material PC
Color Black
Matrix QTY 10*8=80PCS
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN21120
Certification ISO 9001 ROHS SGS
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material PC Color Black
Matrix QTY 10*8=80PCS Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding Brand Name Hiner-pack
Model Number HN21120 Certification ISO 9001 ROHS SGS
Place of Origin CHINA
High Light PC Waffle Pack Chip TrayGeneral Cleaning Waffle Pack Chip TrayUltrasonic Cleaning Waffle Pack Chip Trays

China Manufacturer High quality Black PC Waffle Pack Chip Tray

The chip tray is mainly used for QFA, BGA, TSOP, PGA and other semiconductor packaging inspection, storage and transportation. They can also provide functions such as high temperature resistance, anti-static electricity and so on. We design and manufacture such products to meet the needs of our customers.

 

Hiner-pack as a specialist manufacturer of industrial products and component trays, we create trays for the transport, packaging, storage and protection of a wide variety of precision components. From optical components to electronic components, we will continue to do our best to create a richer lineup of IC trays and other products.

 

Details of the HN21120 Black Waffle Pack

HN21120 waffle pack is used to provide clean, safe packaging for bare mode and other microelectronic devices. It’s a standard design of a 4-inch square with a 10*8 matrix. The chip tray should be selected for pocket size, with the aim of not allowing the device to rotate or flip over in the pocket.

 

Hiner-pack has a large inventory of industry standard chip trays to meet your packaging needs. At the same time, according to the different needs of customers, there are also lids, clips and Tyvek paper for use with the chip tray base. In addition, we can also provide professional customized service according to the size and drawings provided by customers. With the perfect design to achieve the most reasonable loading.

Outline Line Size 101.57*101.57*5.5mm Brand Hiner-pack
Model HN21120 Package Type Die
Cavity Size 9.58*7.43*2.38 Matrix QTY 10*8=80PCS
Material PC HS Code 3923900000
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Application of HN21120 Waffle Pack Chip Tray

Electronic component                       Semiconductor

 

Micro and Nano systems                  Sensor IC

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

 

Advantages

1.We made all products with best material had passed certificate.
2.We have our professional designer so that we can not only produce customers own design, but also we can design for customers based on the customers requests.
3.100% manufacturer,competitive price.
4.The samples are free.
5.We will provide best service since we meet the client,and will do our best to solve the entire problem.

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Ans:Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Ans:Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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