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Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip
China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

  1. China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip
  2. China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip
  3. China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip
  4. China ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS
Color Black
Matrix QTY 10*20=200PCS
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number HN21118
Certification ISO 9001 ROHS SGS
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material ABS Color Black
Matrix QTY 10*20=200PCS Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding Brand Name Hiner-pack
Model Number HN21118 Certification ISO 9001 ROHS SGS
Place of Origin CHINA
High Light ABS Waffle Pack Chip Tray2 Inch Waffle Pack Chip TrayTiny Waffle Pack Chip Trays

ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

The Waffle pack is an ideal tray for storing and transporting tiny electronic components because of its permanent anti-static properties. At the same time, it also has good mechanical strength and heat resistance, which will not be affected by the environment, time and temperature.

 

Because the product is prone to friction during storage and transportation, the ABS chip tray can effectively release the static charge accumulated on the surface of the object. If the packaging does not have anti-static properties, the product quality may be affected during transportation and even been damaged.

 

Details about The HN21118 Waffle Pack

The HN21118 waffle pack is tray made of industrial plastic ABS. It has a variety of excellent properties, such as good dimensional stability, heat resistance, low temperature resistance and excellent anti-static electrical properties. In addition, the resistance to chemical corrosion is also very strong, which makes it a very widely used industrial plastics.

 

The waffle pack is small in size,light in weight, suitable for transferring or loading, samples for testing. The matrix 10*20 can hold more products and saves the transportation cost.It is the best choice for customers to transport and store their products.

Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model HN21118 Package Type Die
Cavity Size 2.8*1.0*0.3 Matrix QTY 10*20=200PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Application of the HN21118 Black 2 inch Chip Tray

Electronic Components                 Semiconductor

 

Embedded System                        Micro and Anon System

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages

1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whats app, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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