Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE |
| Color | Black |
| Temperature | 150°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining |
| Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | HN21106 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Shenzhen China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | PPE | Color | Black |
| Temperature | 150°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining | Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack | Model Number | HN21106 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Shenzhen China |
| High Light | Heat Resistant JEDEC Matrix Tray ，0.76mm JEDEC Matrix Tray ，Ultrasonic Cleaning JEDEC Matrix Trays | ||
Jedex Matrix Tray In Line With JEDEC Standards Heat Resistant
Hiner-pack offers a wide range of JEDEC matrix trays and transport IC trays, which are mainly used to store and transport ic products (integrated circuits), other components and modules. The heat resistant IC tray is used by semiconductor chip companies for packaging and baking tests of their chips. Because it can be baked in 120℃-220℃ environment without deformation characteristics, so the electronic industry is commonly known as this tray for "high temperature plate".
Due to the particularity of this plastic products, this tray can not only be used many times and repeatedly, but also meet the degradation requirements of waste raw materials after damage. The product is completely harmless to nature after degradation and will not have an impact on customer products and the environment.
Details about the HN21106 Heat Resistant Matrix Trays
The main material of HN21106 tray is PPE, which is a kind of heat resistant material. The product not only has good thermal stability and can avoid cracking phenomenon at high temperature, but also fully conforms to RoSH environmental protection standards. Raw materials can be recycled and easily degraded after waste, so customers don't have to worry about environmental issues.
Compared with ordinary products, our trays are small in size, light in weight and low in transportation cost. At the same time, we can provide a variety of package design solutions according to your chip products. Custom trays are not only suitable for storing ic products, but also for protecting electronic devices.
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN21106 | Package Type | Die |
| Cavity Size | 26.45*28.5*2.2 | Matrix QTY | 3*8=24PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of the HN21106 Heat Resistant JEDEC Trays
Semiconductor Electronic component factories
SMT Surfacing factories Optical industry
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
Our Service With IC Tray Manuefacturer
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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