Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | ABS |
| Color | Black |
| Property | ESD |
| Design | Non-standard |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN21102 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | ABS | Color | Black |
| Property | ESD | Design | Non-standard |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω | Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method | Injection Moulding |
| Brand Name | Hiner-pack | Model Number | HN21102 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | 0.2mm Flatness Waffle Pack ，IC Parts Waffle Pack ，2 Inch IC Chip Tray | ||
The Waffle pack is a bare chip carrier used for transporting and handling small batches of Mrico chips. It is usually a plastic tray whose pockets are sized to fit a particular chip.
The Waffle pack is almost the pocketed tray and usually made of plastic.When packing, factories typically use pickup and placement equipment for loading so that each pocket contains a IC "on the inside". After loading,the IC parts are covered with anti-static tyvek paper and lids. Finally, use matching clips to hold the waffle packages together.
Details about the HN21102 Black ESD 2 Inch Waffle Pack
This HN21102 waffle pack has distinct advantages over regular tape reel, Especially for very small parts. It allows automatic loading of electronic parts 5.3*5.3mm and can provide safe and assured professional packaging for the parts provided by customers.
At the same time,It is made of a good conductive material which can effectively release the charge on the surface of the product.This greatly reduces the rate of damage during production, and the use of waffle packaging can both reduce the cost and improve the quality of the product.
| Outline Line Size | 50.8*50.8*4mm | Brand | Hiner-pack |
| Model | HN21102 | Package Type | Die |
| Cavity Size | 5.31*5.31*0.41 | Matrix QTY | 7*7=49PCS |
| Material | ABS.PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Product Application Of Waffle Pack Chip Tray
Electronic component Embedded System
Test and Measurement Technology Power supply
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages Of IC Tray
1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers.
3. Can be washed at specified temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.
FAQ Of Bare Die Tray
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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