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{"title":"Transport IC Components Injection JEDEC Standard Trays With Big Pocket Size","imgUrl":"https:\/\/img.chinax.com\/nimg\/06\/a3\/ee8f7df69b0c7218fef42cccab15-200x200-1\/transport_ic_components_injection_jedec_standard_trays_with_big_pocket_size.jpg","attrs":{"Material":"PPE","Color":"Black","Temperature":"125\u00b0C","Property":"ESD,Non-ESD"}}
{"title":"High Temperature Resistant JEDEC Matrix Trays Transport RF IC","imgUrl":"https:\/\/img.chinax.com\/nimg\/5e\/ce\/8e8122eae0540957f9660c4a2952-200x200-1\/high_temperature_resistant_jedec_matrix_trays_transport_rf_ic.jpg","attrs":{"Material":"PPE","Color":"Black","Temperature":"150\u00b0C","Property":"ESD"}}
{"title":"Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/7f\/629fda44894b042ec332afed0539-200x200-1\/black_mppo_esd_component_tray_7_62mm_thick_for_bga_ic_devices.jpg","attrs":{"Material":"MPPO","Color":"Black","Temperature":"125\u00b0C","Property":"ESD, Non-ESD"}}
{"title":"Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material","imgUrl":"https:\/\/img.chinax.com\/nimg\/05\/5b\/d61e0c55086aef06bffb1fb5a482-200x200-1\/customized_jedec_matrix_trays_loading_fbga_ic_esd_rohs_raw_material.jpg","attrs":{"Material":"PPE","Color":"Black","Temperature":"150\u00b0C","Property":"ESD"}}
Anti-Static Injection Moulding for Output and Fast Production
Product Description
JEDEC (Joint Electronic Device Engineering Council) - www.jedec.org - is responsible for creating open standards in the microelectronics industry. These standards ensure product interoperability, benefiting both the industry and consumers by reducing product development time and costs while increasing efficiency and productivity. JEDEC trays all adhere to the same size, standardized outline, and required features.
Placing parts in a JEDEC tray guarantees that your components can be easily processed in industry-standard automation equipment, including pick and place machines, inspection tools, laser marking devices, testing equipment, and dispensing tools. It is simple to integrate commercially available JEDEC tray feeders into custom process machines.
The maximum baking temperature is clearly marked on JEDEC trays. Exceeding this specified temperature during baking can lead to alterations in the tray's dimensions and potentially harm the contents. The tray's maximum temperature rating is determined by the type of molding compound utilized during manufacturing.
Features
JEDEC trays are custom designed and manufactured, often device and manufacturer specific
Component footprint for PCB layout is more tightly controlled than packaging
Off-the-shelf options available for high-demand custom trays
Open-tooled custom molds available with minimum quantity requirements
Technical Parameters
Parameter
Value
Brand
Hiner-pack
Outline Line Size
322.6x135.9x7.62mm
Model
HN24120
Cavity Size
15.9*10.3*2.6mm
Material
MPPO
Matrix QTY
8*14=112PCS
Package Type
IC Component
Flatness
MAX 0.76mm
Color
Black
Resistance
1.0x10e4-1.0x10e11Ω
Certificate
RoHS, IOS
Applications
Packaging: JEDEC trays function as containers with stacking features for efficient storage.
Transportation & Storage: Ideal for safe transport of components locally or internationally.
Protection: Provides mechanical and electrostatic discharge (ESD) protection.
Standardization: Offers compatibility with most semiconductor and PC board manufacturing equipment.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...
