Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | China |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Durable | Yes |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Customized Service | Support Standard And Non-standard |
| Molding Method | Injection Moulding |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Stackable | Yes |
| Material | MPPO |
| Brand Name | Hiner-pack |
| Model Number | HN24137 |
| Certification | RoHS、ISO |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | China | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | 1~2 Weeks | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Durable | Yes | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Customized Service | Support Standard And Non-standard | Molding Method | Injection Moulding |
| Color | Black, Red, Yellow, Green, White, Etc. | Stackable | Yes |
| Material | MPPO | Brand Name | Hiner-pack |
| Model Number | HN24137 | Certification | RoHS、ISO |
| Place of Origin | SHENZHEN CHINA | ||
| High Light | JEDEC IC tray for modules ，customizable PCB tray pockets ，durable JEDEC matrix tray | ||
Durable IC Tray For Modules And PCBs JEDEC Format with Customizable Pocket Layout
This JEDEC matrix tray for modules is designed to accommodate larger or hybrid electronic assemblies while maintaining the same reliability and protection as standard IC trays. Constructed from durable, ESD-safe polymer, it ensures secure handling and transport of modules through automated assembly, testing, and storage processes. The tray's uniform pockets and integrated orientation markers help maintain consistent placement and alignment, while its robust stacking design enhances storage efficiency and safety during operations.
Module-Compatible JEDEC Outline – Conforms to JEDEC standards while providing larger pockets suited for module-level assemblies.
ESD-Safe Construction – Conductive polymer material protects sensitive modules from electrostatic discharge throughout handling and processing.
Secure Part Retention – Pockets are molded to maintain modules in a stable position, reducing movement and potential damage during automation.
Automation-Optimized Design – Includes chamfered corners, and orientation guides for seamless robotic handling.
Stacking Reliability – Interlocking perimeter features ensure trays remain stable when stacked, minimizing the risk of slippage or tipping.
Durable and Long-Lasting – Maintains shape and structural integrity even under repeated handling, moderate process temperatures, and automated workflows.
| Brand | Hiner-pack |
| Model | HN24137 |
| Material | MPPO |
| Package Type | Module |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 43*42.5*2.7mm |
| Matrix QTY | 2*6=12PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
Flexible customization options allow this tray to meet specific module requirements:
Pocket Layout Adjustments – Modify pocket size, spacing, or contour to accommodate custom module geometries.
Color Options – ESD-safe materials available in multiple colors to differentiate part types or production stages.
Molded Identification – Permanent codes, batch numbers, or logos can be integrated into the tray for traceability.
Automation Interface Adaptation – Add indexing features, tabs, or cutouts to improve compatibility with specialized handling or feeding systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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