Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | China |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Stackable | Yes |
| Molding Method | Injection Moulding |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Anti-Static | Yes |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Warpage | Less Than 0.76mm |
| Brand Name | Hiner-pack |
| Model Number | HN24133 |
| Certification | RoHS、ISO |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | China | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | 1~2 Weeks | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Stackable | Yes | Molding Method | Injection Moulding |
| Color | Black, Red, Yellow, Green, White, Etc. | Anti-Static | Yes |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω | Warpage | Less Than 0.76mm |
| Brand Name | Hiner-pack | Model Number | HN24133 |
| Certification | RoHS、ISO | Place of Origin | SHENZHEN CHINA |
| High Light | JEDEC tray for BGA QFN packaging ，custom fit IC component tray ，JEDEC matrix tray for DIP | ||
JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
Engineered for precision and reliability, this JEDEC matrix tray delivers consistent performance across semiconductor manufacturing, testing, and packaging processes. Its robust, ESD-safe polymer body resists deformation while maintaining uniform pocket alignment, enabling flawless compatibility with automated feeders and robotic pick-and-place systems. The tray’s thoughtful geometry and smooth surface finish promote safe handling of delicate microelectronic parts, ensuring both process efficiency and component protection throughout the production chain.
JEDEC-Compliant Outline – Universal compatibility with global tray feeders, elevators, and conveyor systems for easy integration.
ESD-Safe Construction – Conductive polymer materials safeguard sensitive parts from static build-up during transport or assembly.
Precision Pocket Layout – Accurately molded pocket arrays ensure reliable part retention and positioning for high-speed automation.
Visual & Mechanical Orientation Aids – Chamfered corners, alignment notches, and pickup recesses allow rapid identification and error-free robotic handling.
Stacking Reliability – Interlocking rims stabilize multiple trays in vertical stacks, maintaining alignment and minimizing shifting.
Operational Longevity – Maintains mechanical integrity and dimensional stability under repeated handling, cleaning, and controlled heating cycles.
| Brand | Hiner-pack |
| Model | HN24133 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x8.12mm |
| Cavity Size | 20.4*8.0*7.41mm |
| Matrix QTY | 9*11=99PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
Packaging – at their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
Transportation & Storage – parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.
Protection – JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.
Versatile customization options are available to align the tray design with specific product or process needs:
Custom Pocket Geometry – Adapt pocket size, contour, and spacing to match non-standard component shapes or unique packaging styles.
Color Variations – Offer ESD-compliant colors for production line differentiation or inventory management.
Embedded Mold Details – Include raised logos, serial codes, or internal batch identifiers for efficient product tracking.
System Interface Enhancements – Add guide slots, support pins, or extended edges to suit proprietary automation or feeder systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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