| Place Of Origin | China |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand) |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Property | ESD, Non-ESD |
| Warpage | Less Than 0.76mm |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Certificate | RoHS, IOS |
| Customized Service | Support Standard And Non-standard |
| Material | MPPO |
| Brand Name | Hiner-pack |
| Model Number | HN24140 |
| Certification | RoHS、ISO |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | China | Packaging Details | 70~100pcs/carton(According To The Customer Demand) |
| Delivery Time | 1~2 Weeks | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Property | ESD, Non-ESD | Warpage | Less Than 0.76mm |
| Color | Black, Red, Yellow, Green, White, Etc. | Certificate | RoHS, IOS |
| Customized Service | Support Standard And Non-standard | Material | MPPO |
| Brand Name | Hiner-pack | Model Number | HN24140 |
| Certification | RoHS、ISO | Place of Origin | SHENZHEN CHINA |
| High Light | JEDEC tray for bake oven ,stackable IC tray design ,high temperature JEDEC matrix tray | ||
High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven
This ESD-Safe JEDEC Tray is specifically designed for the protection and handling of semiconductor devices across automated manufacturing lines. Built from high-performance conductive polymer, it ensures stable electrostatic control while maintaining precise pocket geometry for secure part retention. Its rigid structure and uniform layout provide reliable compatibility with robotic arms, pick-and-place systems, and tray elevators, making it an ideal solution for high-volume, precision-driven production environments.
JEDEC Standard Compliance – Fully meets JEDEC outline specifications to ensure interchangeability with global handling and packaging systems.
Excellent ESD Protection – Conductive material effectively dissipates static charges, protecting sensitive components during every stage of handling.
Precision-Molded Pockets – Consistent pocket design minimizes component movement, ensuring accurate placement during transport or inspection.
Automation Adaptability – Compatible with robotic sorting systems and tray stackers to streamline automated workflows.
Reinforced Frame Design – Strengthened edges reduce flexing and warping, maintaining dimensional accuracy through repeated cycles.
Stacking Efficiency – Interlocking edges enable stable vertical stacking, simplifying storage and transport logistics.
| Brand | Hiner-pack |
| Model | HN24140 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 5.0*6.4*1.03mm |
| Matrix QTY | 11*28=308PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
This tray can be modified to accommodate unique device specifications or process needs:
Custom Pocket Geometry – Designed for chips, modules, or special-shaped components requiring non-standard cavity profiles.
Color Options – ESD-safe materials can be customized in various colors for product or batch distinction.
Permanent Marking Options – Incorporate molded batch codes, serial numbers, or customer logos for traceability.
Automation Interface Options – Optional indexing holes, tabs, or side cutouts for enhanced robotic or conveyor integration.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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