Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | SHENZHEN CN |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Custom Logo | Available |
| Material | ABS, PC, MPPO, PPE, PES, PEI, Etc. |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Cavity Dimensions | Customized |
| Stackable | Yes |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Customization | Available |
| Brand Name | Hiner-pack |
| Model Number | HN24145 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | SHENZHEN CN | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Custom Logo | Available |
| Material | ABS, PC, MPPO, PPE, PES, PEI, Etc. | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Color | Black, Red, Yellow, Green, White, Etc. | Cavity Dimensions | Customized |
| Stackable | Yes | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Customization | Available | Brand Name | Hiner-pack |
| Model Number | HN24145 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CHINA | ||
| High Light | JEDEC Standard ESD Safe Trays ，Automated IC Handling Trays ，Custom JEDEC Matrix Trays | ||
JEDEC Standard ESD Safe Matrix Trays For Automated IC Handling
The JEDEC standard matrix tray represents a critical benchmark in the microelectronics industry, setting the specifications for the safe handling, transport, and storage of Integrated Circuits (ICs), modules, and sensitive components. These standardized carriers are commonly referred to as "matrix" trays due to the precise arrangement of components nestled into fixed-position pockets, defined by rows and columns. The defining feature of all JEDEC standard trays is their globally uniform outline dimensions of 12.7 x 5.35 inches (322.6 x 136mm). This unwavering dimensional consistency makes them the universal language for automated equipment operation worldwide.
JEDEC trays incorporate numerous engineering features optimized for high-volume automation and component safety. The foremost benefit is the Industry Standard recognition; instant access to global equipment and accessories is guaranteed, which significantly de-risks equipment design, accelerates development time, and lowers overall cost. Critical design elements facilitate seamless automation. The tray's center area features flat cells specifically contoured for automated handling via vacuum pick-up tools, ensuring reliable component transfer. For mechanical alignment, a distinct scalloped feature (scalloped feature) is sculpted into one side, allowing the use of a locating pin to mechanically fix the correct orientation during use. A crucial visual aid is the 45-degree chamfer located in one corner, which provides an unambiguous visual indicator for the Pin 1 orientation of the components within the matrix.
| Brand | Hiner-pack |
| Model | HN24145 |
| Material | PPE |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 13*13*2.11mm |
| Matrix QTY | 6*16=96PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
1. Automated Test and Assembly: Their most intensive use is in automated test and assembly processes. The components, ranging from through-hole (PGA, DIP) to surface mount (QFP, BGA) and leadless devices (LGA, QFN), are presented to pick-and-place machines in a precise, machine-readable matrix format.
2. Global Transport and Secure Storage: Parts loaded into stacked JEDEC trays offer an easy, efficient, and highly protective solution for storage and global logistics. The stacking feature inherently allows each successive tray to act as a protective cover for the one beneath it.
3. Process Compatibility: Trays function as carriers for components through various manufacturing steps, which can include high-temperature processes like baking (depending on material, such as mid-temp trays up to 140°C) or cleaning processes.
4. Component Compatibility: Besides traditional ICs (like QFP, BGA, TSOP, PGA etc.), JEDEC trays are also used for non-traditional electronic components including connectors, PCBs, MEMS, lenses, watch parts, and even synthetic stones, leveraging the standardized automation equipment.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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