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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
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China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place
China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place

  1. China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place
  2. China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place
  3. China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place
  4. China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place
  5. China High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place

High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place

  1. MOQ: 1000
  2. Price: $1.5~$6(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Place Of Origin SHENZHEN CN
Packaging Details 70~100pcs/carton(According To The Customer Demand)
Delivery Time Mold:About 25 Days / Product:7~10 Days
Payment Terms 100% Prepayment
Supply Ability 2000PCS/Day
Service Accept OEM,ODM
Flatness/Warpage Less Than 0.76mm
Surface Resistance 1.0x10E4~1.0x10E11Ω
Material ABS, PC, MPPO, PPE, PES, PEI, Etc.
Custom Logo Available
Certifications RoHS, ISO, SGS
Stackable Yes
Matrix Qty 6*12=72PCS
Brand Name Hiner-pack
Model Number HN24148
Certification ISO 9001 ROHS SGS
Place of Origin SHENZHEN CHINA

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  1. Product Details
  2. Company Details

Product Specification

Place Of Origin SHENZHEN CN Packaging Details 70~100pcs/carton(According To The Customer Demand)
Delivery Time Mold:About 25 Days / Product:7~10 Days Payment Terms 100% Prepayment
Supply Ability 2000PCS/Day Service Accept OEM,ODM
Flatness/Warpage Less Than 0.76mm Surface Resistance 1.0x10E4~1.0x10E11Ω
Material ABS, PC, MPPO, PPE, PES, PEI, Etc. Custom Logo Available
Certifications RoHS, ISO, SGS Stackable Yes
Matrix Qty 6*12=72PCS Brand Name Hiner-pack
Model Number HN24148 Certification ISO 9001 ROHS SGS
Place of Origin SHENZHEN CHINA
High Light JEDEC trays for component protectionhigh-precision JEDEC trayscustom pick-and-place JEDEC trays

High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place


In the demanding realm of microelectronics, JEDEC matrix trays serve as the established protocol for component management, ensuring the integrity and efficient handling of high-value ICs and modules. Their designation as "waffle" or "matrix" trays reflects the organized, pocketed structure that secures components in a fixed array of rows and columns. This fixed position and defined spacing are crucial, as they allow absolute dimensional location for automated equipment. The trays adhere to a single, non-negotiable external outline of 12.7 x 5.35 inches (322.6 x 136mm), a dimensional constant that underpins the entire ecosystem of JEDEC-compatible automation. The robust construction, typically from ESD-safe polymers, is a prerequisite, with specifications demanding minimum twist and maximum strength to withstand the rigors of automated handling and global logistics. The material must be clearly marked with its maximum operating temperature—the highest temperature it can endure for 48 continuous hours without compromising its critical dimensional tolerance. This commitment to dimensional stability under thermal stress makes JEDEC trays reliable carriers for both shipping and high-temperature processing, such as component baking.

Features & Benefits:

The inherent value proposition of JEDEC trays lies in their "Precision Built In" design, which significantly minimizes manufacturing risk and enhances process throughput. The trays are engineered with well-established reference features and datums that streamline equipment integration. A cornerstone of their design is the Automation Ready suite of features. The asymmetric end tabs are a clever feature that mechanically prevents improper orientation in feeding mechanisms, acting as an additional safeguard beyond the Pin 1 visual indicators. The sculpted scalloped feature provides a mechanical keying mechanism for positive registration within feeders. Furthermore, designated space for marking and engraving is provided, making the trays a practical tool for inventory management and process tracking. The standard low-profile thickness of 0.25 inches (6.35mm) is expertly designed to accommodate 90% of all standard, lower-profile components like CSP and TQFP, optimizing tray density. The optional 0.40-inch high-profile version ensures that thicker components, such as multi-layer modules or Pin Grid Arrays (PGA), can be stored and transported with the same level of standardized security and precision.

Technical Parameters:

Brand Hiner-pack
Model HN24148
Material MPPO
Package Type IC Component
Color Black
Resistance 1.0x10e4-1.0x10e11Ω
Outline Line Size 322.6x135.9x10.0mm
Cavity Size 20.0*14.7*3.0mm
Matrix QTY 6*12=72PCS
Flatness MAX 0.76mm
Service Accept OEM, ODM
Certificate RoHS, IOS

Applications:

1. Component Protection (ESD and Mechanical)

2. High-Temperature Processes (Baking)

3. Feeder System Compatibility

4. Inter-Industry Standardization

Customization:

The ability to customize the internal matrix while adhering to the standard external footprint is the Adaptable and Process Compatible strength of JEDEC trays.
Component-Specific Geometry Protection: The interior cell geometry is highly adaptable to the unique needs of different component types. 
Universal vs. Dedicated Trays: Some component types, like PGA packages, can utilize unique "universal" trays capable of holding a variety of sizes, owing to the strength of their pin arrays. However, for most other packages, a dedicated, custom-molded tray is designed to maximize protection and capacity for that specific device.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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