Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | China |
| Packaging Details | 500 Pcs/carton(According To Actual Packing） |
| Delivery Time | 1~2 Weeks |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Size | 4-inch |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Molding Method | Injection Moulding |
| Flatness/Warpage | Less Than 0.3mm |
| Temperature | 80°C~120°C |
| Clean Class | General And Ultrasonic Cleaning |
| Features | Anti-static And Dust-proof |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Brand Name | Hiner-pack |
| Model Number | HN24236 |
| Certification | ISO 9001 SGS ROHS |
| Place of Origin | SHENZHEN CHINA |
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Product Specification
| Place Of Origin | China | Packaging Details | 500 Pcs/carton(According To Actual Packing） |
| Delivery Time | 1~2 Weeks | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Size | 4-inch |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω | Molding Method | Injection Moulding |
| Flatness/Warpage | Less Than 0.3mm | Temperature | 80°C~120°C |
| Clean Class | General And Ultrasonic Cleaning | Features | Anti-static And Dust-proof |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Brand Name | Hiner-pack |
| Model Number | HN24236 | Certification | ISO 9001 SGS ROHS |
| Place of Origin | SHENZHEN CHINA | ||
| High Light | Durable Carbon Reinforced Waffle Pack Tray ，Flatness Less Than 0.3mm IC Chip Tray ，Temperature 80°C~120°C Semiconductor Tray | ||
Durable Carbon Reinforced Conductive Waffle Pack Trays For Automated Tool Handling
The waffle pack chip tray is engineered with a core focus on extreme durability, resistance to handling stress, and compatibility with automated tool interfaces. Recognizing that trays in high-volume production cycles face repeated loading, unloading, and shipping, this product integrates advanced materials to ensure maximum lifespan and minimal process interruption. The tray is molded using a high-quality, carbon-fiber reinforced conductive polymer. The carbon reinforcement is not merely for ESD; it provides extraordinary mechanical strength and anti-warping characteristics, guaranteeing that the tray maintains its critical flatness and dimensional alignment throughout its service life, even under rough handling or high stacking loads. Available in both the standard 2×2 and 4×4 inch formats, the tray's permanent ESD-safe properties ensure that sensitive microelectronic devices, such as bare die, COG (Chip-on-Glass), and CSPs, are consistently protected from static discharge.
| HN24236 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| PC | Black | 30*30=900PCS | 1.96*1.38*0.45mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. Free Samples – Selected from e×isting products. | |||
| B. Customized Samples – Produced according to your design or requirements. | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
This ultra-durable waffle pack excels in high-throughput, high-stress microelectronic environments. Its key applications are concentrated where mechanical robustness and reliable automation interface are paramount. These include: High-Volume Bare Die Sorting and Kitting, where the trays are repeatedly loaded and fed into automated handlers; Secure Overseas Transport, utilizing the carbon-fiber strength to withstand stacking pressures and rough handling during shipping; Packaging for Large COG Devices, providing stable support for physically larger components; and Manufacturing Test Lines, ensuring consistent alignment for electrical probe testing and visual inspection. While often used for semiconductors, its reliable operation and superior device protection extend its use to other industries managing small, high-value inventory, such as high-precision medical parts or specialized watch mechanisms, providing a reliable method for inventory management and safeguarding during transit.
Customization services focus heavily on reinforcing durability and optimizing the tray for your specific automated process. We offer: Enhanced Pocket Geometry, where the pocket walls can be thickened or reinforced at critical stress points, or feature specific clearance cuts to improve automated tool suction and release; Material Specificity, allowing the choice of specific polymer grades for enhanced impact resistance or chemical compatibility; Custom Marking, fiducial marks to aid machine vision and inventory tracking; and Bakeable Versions, for customers whose durable trays must also withstand thermal processing up to 180°C.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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