Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | SHENZHEN CHINA |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Certifications | RoHS, ISO, SGS |
| Molding Method | Injection Moulding |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Load Type | IC Component |
| Capacity | 11*15=165PCS |
| Flatness/Warpage | Less Than 0.76mm |
| Stackable | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN24158 |
| Certification | ISO 9001 ROHS SGS |
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Product Specification
| Place Of Origin | SHENZHEN CHINA | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Certifications | RoHS, ISO, SGS |
| Molding Method | Injection Moulding | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Color | Black, Red, Yellow, Green, White, Etc. | Load Type | IC Component |
| Capacity | 11*15=165PCS | Flatness/Warpage | Less Than 0.76mm |
| Stackable | Yes | Brand Name | Hiner-pack |
| Model Number | HN24158 | Certification | ISO 9001 ROHS SGS |
| High Light | 165PCS Capacity JEDEC Tray ，0.76mm Flatness Matrix Tray ，322.6x136mm Outline Waffle Tray | ||
Precision-Engineered JEDEC Trays For Leadless And Lead-Frame Packages
In the electronics industry, JEDEC matrix trays serve as the established protocol for component management, ensuring the integrity and efficient handling of high-value ICs and modules. Their designation as "waffle" or "matrix" trays reflects the organized, pocketed structure that secures components in a fixed array of rows and columns. This fixed position and defined spacing are crucial, as they allow absolute dimensional location for automated equipment. The trays adhere to a single, non-negotiable external outline of 12.7 x 5.35 inches (322.6 x 136mm), a dimensional constant that underpins the entire ecosystem of JEDEC-compatible automation. The robust construction, typically from ESD-safe polymers, is a prerequisite, with specifications demanding minimum twist and maximum strength to withstand the rigors of automated handling and global logistics. The material must be clearly marked with its maximum operating temperature—the highest temperature it can endure for 48 continuous hours without compromising its critical dimensional tolerance. This commitment to dimensional stability under thermal stress makes JEDEC trays reliable carriers for both shipping and high-temperature processing, such as component baking.
The inherent value proposition of JEDEC trays lies in their "Precision Built In" design, which significantly minimizes manufacturing risk and enhances process throughput. The trays are engineered with well-established reference features and datums that streamline equipment integration. A cornerstone of their design is the Automation Ready suite of features. The asymmetric end tabs are a clever feature that mechanically prevents improper orientation in feeding mechanisms, acting as an additional safeguard beyond the Pin 1 visual indicators. The sculpted scalloped feature provides a mechanical keying mechanism for positive registration within feeders. Furthermore, designated space for marking and engraving is provided, making the trays a practical tool for inventory management and process tracking. The standard low-profile thickness of 0.25 inches (6.35mm) is expertly designed to accommodate 90% of all standard, lower-profile components like CSP and TQFP, optimizing tray density. The optional 0.40-inch high-profile version ensures that thicker components, such as multi-layer modules or Pin Grid Arrays (PGA), can be stored and transported with the same level of standardized security and precision.
| Brand | Hiner-pack |
| Model | HN24158 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 15.2*6.0*2.2mm |
| Matrix QTY | 11*15=165PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
JEDEC trays are multifunctional, acting as an essential conduit through various stages of the manufacturing lifecycle.
1. Component Protection (ESD and Mechanical)
2. High-Temperature Processes (Baking)
3. Feeder System Compatibility
The ability to customize the internal matrix while adhering to the standard external footprint is the Adaptable and Process Compatible strength of JEDEC trays.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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