Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | SHENZHEN CHINA |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Material | MPPO |
| Molding Method | Injection Moulding |
| Certifications | RoHS, ISO, SGS |
| Rohs Compliant | Yes |
| Flatness/Warpage | Less Than 0.76mm |
| Temperature | 150°C |
| Processing | Injection |
| Color | Black, Red, Yellow, Green, White, Etc. |
| Brand Name | Hiner-pack |
| Model Number | HN24157 |
| Certification | ISO 9001 ROHS SGS |
View Detail Information
Explore similar products
Precision High Temperature Anti-Static Custom JEDEC Trays For Tiny Electronic
SGS Lightweight Custom JEDEC Trays With Electronic Connectors
ROHS MPPO Material JEDEC Matrix Tray For ESD Electronic Components
Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature
Product Specification
| Place Of Origin | SHENZHEN CHINA | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Material | MPPO |
| Molding Method | Injection Moulding | Certifications | RoHS, ISO, SGS |
| Rohs Compliant | Yes | Flatness/Warpage | Less Than 0.76mm |
| Temperature | 150°C | Processing | Injection |
| Color | Black, Red, Yellow, Green, White, Etc. | Brand Name | Hiner-pack |
| Model Number | HN24157 | Certification | ISO 9001 ROHS SGS |
| High Light | Low-Profile JEDEC Tray ，Less Than 0.76mm Flatness IC Component Tray ，Pin 1 Markers Matrix Tray | ||
Plastic Low-Profile JEDEC Trays High-Density Carriers For IC Components
The Low-Profile JEDEC matrix tray, with its standardized 0.25-inch (6.35mm) thickness, is the workhorse of the microelectronics assembly line. This specific profile is engineered to accommodate 90% of all standard-height components, including popular packages such as BGA (Ball Grid Array), CSP (Chip Scale Package), TQFP (Thin Quad Flat Package), and SOIC (Small Outline Integrated Circuit). The foundation of this system is the unwavering 12.7 x 5.35 inches (322.6 x 136mm) global outline dimension, which guarantees a universal interface with automated handling and feeding equipment. By optimizing the thickness, the low-profile trays maximize vertical storage and feeder capacity, a critical factor in high-volume manufacturing environments. These trays are constructed from high-strength, ESD-safe polymers—often black for conductivity—to protect sensitive ICs from static discharge. Their design focuses on minimum twist and superior dimensional stability, ensuring that the precise location (pitch) of every component pocket remains accurate for high-speed automated pick-and-place operations.
Low-Profile JEDEC trays offer a balance of high-density storage and precision component handling.
1. Vertical Density Optimization
2. Vacuum Pickup Efficiency
3. Pin 1 and Orientation Markers
4. Interlocking Stacking
5. Industry Standard Compatibility| Brand | Hiner-pack |
| Model | HN24157 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 10.4x7.94x1.85mm |
| Matrix QTY | 7*14=98PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
Low-Profile JEDEC trays are indispensable for a variety of critical manufacturing processes.
2. High-Volume SMT Assembly
2. Component Testing
3. Moisture Sensitive Device (MSD) Handling
The flexibility of the internal matrix is key to serving the broad range of components that fit within the low profile.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!