Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | SHENZHEN CHINA |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day |
| Flatness/Warpage | Less Than 0.76mm |
| Stackable | Yes |
| Material | MPPO |
| Molding Method | Injection Moulding |
| Temperature | 80°C To 180°C |
| Processing | Injection |
| Rohs Compliant | Yes |
| Load Type | Module |
| Brand Name | Hiner-pack |
| Model Number | HN24155 |
| Certification | ISO 9001 ROHS SGS |
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Product Specification
| Place Of Origin | SHENZHEN CHINA | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days | Payment Terms | 100% Prepayment |
| Supply Ability | 2000PCS/Day | Flatness/Warpage | Less Than 0.76mm |
| Stackable | Yes | Material | MPPO |
| Molding Method | Injection Moulding | Temperature | 80°C To 180°C |
| Processing | Injection | Rohs Compliant | Yes |
| Load Type | Module | Brand Name | Hiner-pack |
| Model Number | HN24155 | Certification | ISO 9001 ROHS SGS |
| High Light | 0.40-inch Height JEDEC Tray ，High-Profile Matrix Tray ，Module Load Type IC Carrier Tray | ||
High-Profile JEDEC Trays Secure Carriers For Thick Modules And Assemblies
The High-Profile JEDEC matrix tray is specifically designed to meet the rigorous handling and protection needs of thicker (high) components, modules, and assemblies that exceed the clearance of standard low-profile trays. With a standardized thickness of 0.40 inches (10.16mm), this variant ensures adequate vertical clearance for components like PLCC (Plastic Leaded Chip Carrier), CERQUAD, high-density PGA (Pin Grid Arrays), and various finished modules. As with all JEDEC standards, the external outline remains a fixed 12.7 x 5.35 inches (322.6 x 136mm), preserving its universal compatibility with the vast global infrastructure of JEDEC automation equipment. Constructed for exceptional strength and dimensional stability, high-profile trays are crucial for securing components with features that are vulnerable to bending or impact, such as the numerous pins on a PGA device or the complex structure of a pre-assembled module. They are typically manufactured from robust, ESD-safe molding compounds to ensure both mechanical protection and electrical safety.
High-Profile JEDEC trays are characterized by enhanced robustness and dedicated clearance for complex components.
1. Critical Vertical Clearance: The 0.40-inch height is the primary benefit, providing the necessary vertical space to protect tall components from contact with the tray above when stacked. This is vital for packages like PLCC, where the J-leads extend below the body, or for PGA packages with long pin arrays.
2. Universal Compatibility (External): Despite the increased thickness, the fixed $12.7 times 5.35$ inch footprint ensures seamless integration into all JEDEC-compatible feed systems, stackers, and dry storage solutions. This eliminates the need for unique, high-profile-specific automation hardware.
3. Enhanced Stack Security: The high-profile trays utilize the same interlocking stack features as the low-profile versions, ensuring that the heavier, more substantial trays and their contents remain stable and secure, even when stacked for storage or transit.
| Brand | Hiner-pack |
| Model | HN24155 |
| Material | MPPO |
| Package Type | Module |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x12.19mm |
| Cavity Size | 31*31*3.8mm |
| Matrix QTY | 3*8=24PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
The application of high-profile JEDEC trays is focused on securing and standardizing the flow of larger and taller components.
The internal volume provided by the high profile allows for extensive customization to secure complex component geometries.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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