Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Anti-Static | Yes |
| Use | Transport, Storage, Packing |
| Flatness | <0.3mm |
| Size | Customized |
| Injection Mold | Lead Time 20~25 Days |
| Color | Black |
| Shape | Rectangular |
| Heat Resistant | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN24045 |
| Certification | ROHS |
| Place of Origin | Shenzhen,China |
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Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Anti-Static | Yes |
| Use | Transport, Storage, Packing | Flatness | <0.3mm |
| Size | Customized | Injection Mold | Lead Time 20~25 Days |
| Color | Black | Shape | Rectangular |
| Heat Resistant | Yes | Brand Name | Hiner-pack |
| Model Number | HN24045 | Certification | ROHS |
| Place of Origin | Shenzhen,China | ||
| High Light | black bare die tray ，bare die tray 6.71x3.90 size ，bare die tray with cavity | ||
Our Bare Die Trays can provide a secure and organized way to handle delicate bare die components during production, assembly, testing, and shipping.They are designed in a rectangular shape to efficiently accommodate multiple bare die chips. Their customized size ensures a perfect fit for various die sizes, offering flexibility and versatility in handling different types of components. These trays come in a sleek black color, giving them a professional and modern look suitable for industrial environments.
| Durability | Sturdy And Impact-Resistant |
| Color | Black |
| Injection Mold | Lead Time 20~25 Days |
| Capacity | Holds Multiple Bare Die Chips |
| Customizable Logo | Yes |
| Flatness | <0.3mm |
| Shape | Rectangular |
| Size | Customized |
| Anti-Static | Yes |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
I.Chip On Board (COB) Assembly
Bare Die Trays provide secure positioning and electrostatic discharge (ESD) protection for singulated semiconductor dice during manual or automated COB assembly processes.
II.Flip Chip and 3D Packaging
The trays' precision-engineered pockets accommodate backside-exposed dice required for flip chip bonding, enabling accurate alignment during flux application and reflow processes.
♠Customized Packaging Solutions: We offer tailored Bare Die Trays designed to meet the specific requirements of your die sizes and configurations, ensuring optimal protection and handling during transportation and storage.
♠On-site Technical Support: Our team of experts provides on-site assistance for the installation, integration, and troubleshooting of Bare Die Trays, ensuring seamless operations and minimizing downtime.
Q:How long can the production be put into production after the order is placed?
A:Generally, it takes one or two working days.
Q: What is the minimum order quantity for the Bare Die Trays?
A: The minimum order quantity for the Bare Die Trays is 1000 pieces.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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