Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Optional | Lid/Cover And Clip/Clamp |
| Molding Method | Injection Moulding |
| Property | ESD,Non-ESD |
| Warpage | ＜0.3mm |
| Shape | Rectangular |
| Custom Logo | Available |
| Heat Resistant | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN25064 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Shenzhen,China |
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Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Optional | Lid/Cover And Clip/Clamp |
| Molding Method | Injection Moulding | Property | ESD,Non-ESD |
| Warpage | ＜0.3mm | Shape | Rectangular |
| Custom Logo | Available | Heat Resistant | Yes |
| Brand Name | Hiner-pack | Model Number | HN25064 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Shenzhen,China |
| High Light | Bare Die Tray 11x13 capacity ，Semiconductor industry die tray ，143PCS bare die storage | ||
As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.
♦Temporary Storage in Semiconductor Production:
During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.
♦Chip Transportation and Distribution:
As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.
Brand Name: Hiner-pack
Model Number: HN25064
Place Of Origin: Shenzhen, China
Packaging Details: It Depends On The QTY Of Order And Size Of Product
Molding Method: Injection Moulding
Heat Resistant: Yes
|
Outline Line Size |
101.6*101.6*6mm |
Brand |
Hiner-pack |
|
Model |
HN 25064 |
Package Type |
FBGA IC |
|
Cavity Size |
5.7*4.2*2.25mm |
Matrix QTY |
11*13=142PCS |
|
Material |
ABS,PC |
Flatness |
MAX 0.3mm |
|
Color |
Black |
Service |
Accept OEM,ODM |
|
Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS |
♠Product Packaging:
The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.
♠Shipping:
Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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