Shenzhen Hiner Technology Co., Ltd.
| Clean Class | General And Ultrasonic Cleaning |
| Tray Shape | Rectangular |
| Supply Ability | 2000PCS/Day |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Payment Terms | T/T |
| Outline Line Size | 50.7×50.7×7.4 mm |
| Cavity Size | 1.30x1.15x0.72 mm |
| Warpage | Warpage MAX 0.2mm |
| Capacity | 17x18=306 PCS |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Packing Level | Transport package |
| Color | Black |
| Place of Origin | China |
| Model Number | HN24175 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
View Detail Information
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Product Specification
| Clean Class | General And Ultrasonic Cleaning | Tray Shape | Rectangular |
| Supply Ability | 2000PCS/Day | Mold Type | Injection |
| Reusable | Yes | Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Payment Terms | T/T | Outline Line Size | 50.7×50.7×7.4 mm |
| Cavity Size | 1.30x1.15x0.72 mm | Warpage | Warpage MAX 0.2mm |
| Capacity | 17x18=306 PCS | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Packing Level | Transport package | Color | Black |
| Place of Origin | China | Model Number | HN24175 |
| Brand Name | Hiner-pack | Certification | ROHS, ISO |
| High Light | ESD anti-static waffle pack trays ，semiconductor IC chip trays ，waffle pack trays for electronics | ||
This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.
It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.
It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 17x18=306 PCS | ||
| Service | Accept OEM, ODM | ||
It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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