| Clean Class | General And Ultrasonic Cleaning |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Reusable | Yes |
| Capacity | 10x20=200 PCS |
| Mold Type | Injection |
| Packing Level | Transport package |
| Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Payment Terms | T/T |
| Color | Usually black |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Warpage | Warpage MAX 0.24mm |
| Tray Shape | Rectangular |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Brand Name | Hiner-pack |
| Model Number | HN24164 |
| Place of Origin | China |
| Certification | ROHS, ISO |
View Detail Information
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Product Specification
| Clean Class | General And Ultrasonic Cleaning | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Reusable | Yes |
| Capacity | 10x20=200 PCS | Mold Type | Injection |
| Packing Level | Transport package | Packaging Details | CARTON, PALLET |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Payment Terms | T/T |
| Color | Usually black | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Warpage | Warpage MAX 0.24mm | Tray Shape | Rectangular |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Brand Name | Hiner-pack |
| Model Number | HN24164 | Place of Origin | China |
| Certification | ROHS, ISO | ||
| High Light | cleanroom waffle pack trays ,high precision IC storage trays ,contamination control chip trays | ||
High precision cleanroom waffle pack trays fit strict semiconductor cleanroom production standards. Delivers powerful particulate contamination isolation performance for ultra-fine pitch fragile IC components. Do you need professional precision holders to guard valuable chips from pollution damage during manufacturing?
Features standardized JEDEC elongated grid cavity structure. Resists scratches, static interference and dust invasion effectively. Maintains stable clean performance across chip handling, transfer and daily storage procedures.
Owns durable stackable precision loading design. Fully adapts semiconductor packaging, testing, logistics transportation and inventory demands. Preserves complete clean intact status of high-value sensitive IC chips in whole industrial chains.
| Brand | Hiner-pack | ||
| Color | Usually black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 10x20=200 PCS | ||
| Cavity Size | 3.00X0.7X0.22 | ||
| Service | Accept OEM, ODM | ||
Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.
With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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