Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×6.2 mm |
| Cavity Size | 1.35x1.30x1.0 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.26mm |
| Capacity | 10x10=100 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24168 |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
Explore similar products
Digital Array Waffle Pack Chip Trays Durable Anti Static For Component
ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
Electronic Parts Waffle Pack Tray Stable Resistance ESD ABS Custom Size
2-inch and 4-inch Waffle Pack Chip Trays
Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.8×50.8×6.2 mm |
| Cavity Size | 1.35x1.30x1.0 mm | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection | Reusable | Yes |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Packing Level | Transport package |
| Warpage | Warpage MAX 0.26mm | Capacity | 10x10=100 PCS |
| Brand Name | Hiner-pack | Model Number | HN24168 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | Dense cavity waffle pack IC trays ，Durable IC handling waffle trays ，Waffle pack chip trays with warranty | ||
Dense cavity JEDEC waffle pack trays meet strict international semiconductor cleanroom standards. Delivers stable particulate contamination isolation and professional ESD anti-static performance, fully protecting fragile fine pitch integrated circuit components from production damage.
Features uniform precise dense square cavity grid structure. Owns durable interlocking stackable design, effectively resists dust pollution, scratch damage and electrostatic interference through all chip handling and transfer procedures.
Covers full semiconductor packaging, inspection, testing, logistics transportation and inventory storage scenarios. Maintains long-term clean and stable status for sensitive high-value IC chips. Supports fully customized pocket cavity specifications for diversified chip models.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×6.2 mm | ||
| Matrix QTY | 10x10=100 PCS | ||
| Service | Accept OEM, ODM | ||
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!