Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×3.94 mm |
| Cavity Size | 4.64x4.22x0.755 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm |
| Capacity | 6x7=42 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24171 |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
Explore similar products
Digital Array Waffle Pack Chip Trays Durable Anti Static For Component
ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
Electronic Parts Waffle Pack Tray Stable Resistance ESD ABS Custom Size
2-inch and 4-inch Waffle Pack Chip Trays
Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.8×50.8×3.94 mm |
| Cavity Size | 4.64x4.22x0.755 mm | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection | Reusable | Yes |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm | Capacity | 6x7=42 PCS |
| Brand Name | Hiner-pack | Model Number | HN24171 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | ESD anti static waffle chip trays ，semiconductor waffle pack trays ，anti static chip storage trays | ||
Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?
Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.
Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×3.94 mm | ||
| Matrix QTY | 6x7=42 PCS | ||
| Service | Accept OEM, ODM | ||
Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!