Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Outline Line Size | 50.8×50.8×3.94 mm |
| Cavity Size | 6.49x3.86x0.67 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm |
| Capacity | 5x7=35 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24174 |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Color | Black |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Outline Line Size | 50.8×50.8×3.94 mm |
| Cavity Size | 6.49x3.86x0.67 mm | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection | Reusable | Yes |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm | Capacity | 5x7=35 PCS |
| Brand Name | Hiner-pack | Model Number | HN24174 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | anti-static semiconductor IC chip trays ，high temperature waffle pack trays ，cross-slot waffle chip trays | ||
Deliver stable anti-static protection for IC chips. Withstand up to 125℃ high temperature. Adopt optimized cross-slot structure to lock components tightly. Keep chips safe from dust and contamination. Need reliable semiconductor chip carrying solutions?
Fit semiconductor encapsulation, chip testing, die sorting and wafer processing. Adapt to automated production lines and precision handling workflows. Work smoothly in cleanroom and workshop environments.
Support chip turnover, storage, logistics and vacuum packaging. Offer flexible cavity size, layout and material customization. Create exclusive cross-slot designs for various IC models to meet specific needs.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×3.94 mm | ||
| Matrix QTY | 5x7=35 PCS | ||
| Service | Accept OEM, ODM | ||
Support chip internal turnover, long-term storage, logistics and vacuum packaging. Meet diversified integrated circuit processing and electronic assembly needs.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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