Shenzhen Hiner Technology Co., Ltd.
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Packing Level | Transport package |
| Mold Type | Injection |
| Reusable | Yes |
| Packaging Details | CARTON, PALLET |
| Color | Usually black or dark gray for ESD protection |
| Delivery Time | 10 workdays |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Warpage | Warpage MAX 0.2mm |
| Tray Shape | Rectangular |
| Supply Ability | 2000PCS/Day |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Clean Class | General And Ultrasonic Cleaning |
| Capacity | 18x12=216 PCS |
| Payment Terms | T/T |
| Model Number | HN24150 |
| Brand Name | Hiner-pack |
| Place of Origin | China |
| Certification | ROHS, ISO |
View Detail Information
Explore similar products
Digital Array Waffle Pack Chip Trays Durable Anti Static For Component
ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
Electronic Parts Waffle Pack Tray Stable Resistance ESD ABS Custom Size
2-inch and 4-inch Waffle Pack Chip Trays
Product Specification
| Incoterms | EXW, FOB, CIF, DDU, DDP | Packing Level | Transport package |
| Mold Type | Injection | Reusable | Yes |
| Packaging Details | CARTON, PALLET | Color | Usually black or dark gray for ESD protection |
| Delivery Time | 10 workdays | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Warpage | Warpage MAX 0.2mm | Tray Shape | Rectangular |
| Supply Ability | 2000PCS/Day | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Clean Class | General And Ultrasonic Cleaning | Capacity | 18x12=216 PCS |
| Payment Terms | T/T | Model Number | HN24150 |
| Brand Name | Hiner-pack | Place of Origin | China |
| Certification | ROHS, ISO | ||
| High Light | cleanroom waffle pack IC trays ，contamination control IC storage trays ，secure waffle pack chip trays | ||
Cleanroom waffle pack IC trays adapts to strict semiconductor cleanroom production environments. Meets international cleanroom-grade standards, provides reliable contamination control performance for delicate fine pitch IC chips.
Adopts standardized JEDEC precise grid cavity structure. Prevents dust pollution damage effectively, maintains stable performance during daily chip storage, handling and transfer procedures.
Supports fully customized cavity layouts for diverse chip specifications. Owns excellent anti-static performance, perfectly matches semiconductor packaging, testing and logistics needs, offers long-lasting stable protection for high-value precision IC chips.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Usually black or dark gray for ESD protection | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 18x12=216 PCS | ||
| Service | Accept OEM, ODM | ||
Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.
With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!