Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Color | Usually black |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 2x1.12x0.86 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.25mm |
| Capacity | 10x10=100 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24152 |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
Explore similar products
Digital Array Waffle Pack Chip Trays Durable Anti Static For Component
ESD Antistatic Matrix Chip Waffle Tray Moisture Protection SGS Approved
Electronic Parts Waffle Pack Tray Stable Resistance ESD ABS Custom Size
2-inch and 4-inch Waffle Pack Chip Trays
Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Color | Usually black | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 2x1.12x0.86 mm | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection | Reusable | Yes |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Packing Level | Transport package |
| Warpage | Warpage MAX 0.25mm | Capacity | 10x10=100 PCS |
| Brand Name | Hiner-pack | Model Number | HN24152 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | Cleanroom waffle pack IC trays ，Waffle pack chip protection trays ，IC protection cleanroom trays | ||
JEDEC standard waffle pack trays adapt to strict semiconductor cleanroom environments. Delivers stable dust isolation and contamination control performance for high-value fragile IC components. Do you need reliable holders to guard fine pitch chips from pollution damage in production?
Features precise closed grid cavity structure. Resists scratch damage and static interference effectively. Maintains stable clean performance through whole chip manufacturing and processing procedures.
Owns stackable durable loading design. Matches packaging, testing, logistics transportation and inventory storage demands perfectly. Preserves intact clean status of sensitive semiconductor chips across entire supply chain links.
| Brand | Hiner-pack | ||
| Color | Usually black | ||
| Outline Line Size | 50.8×50.8×4 mm | ||
| Matrix QTY | 10x10=100 PCS | ||
| Service | Accept OEM, ODM | ||
Cleanroom JEDEC waffle trays serve complete semiconductor industrial chains, covering chip manufacturing, packaging processing, quality inspection, reliability testing, logistics delivery and long-term inventory storage.
Powered by high anti-pollution performance, trays fit QFN/BGA/CSP fine pitch packaging projects. Adapts automated production lines, chip testing operations and daily high-value IC inventory management systems well.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!