Shenzhen Hiner Technology Co., Ltd.
| Cavity Size | 1.08x1.08x2.18 mm |
| Clean Class | General And Ultrasonic Cleaning |
| Color | Black |
| Capacity | 15x15=215 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Reusable | Yes |
| Outline Line Size | 50.8×50.8×4.36 mm |
| Mold Type | Injection |
| Packaging Details | CARTON, PALLET |
| Supply Ability | 2000PCS/Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Tray Shape | Rectangular |
| Payment Terms | T/T |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Delivery Time | 10 workdays |
| Warpage | Warpage MAX 0.26mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Packing Level | Transport package |
| Certification | ROHS, ISO |
| Model Number | HN24146 |
| Place of Origin | China |
| Brand Name | Hiner-pack |
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Product Specification
| Cavity Size | 1.08x1.08x2.18 mm | Clean Class | General And Ultrasonic Cleaning |
| Color | Black | Capacity | 15x15=215 PCS |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Reusable | Yes |
| Outline Line Size | 50.8×50.8×4.36 mm | Mold Type | Injection |
| Packaging Details | CARTON, PALLET | Supply Ability | 2000PCS/Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Tray Shape | Rectangular |
| Payment Terms | T/T | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Delivery Time | 10 workdays | Warpage | Warpage MAX 0.26mm |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Packing Level | Transport package |
| Certification | ROHS, ISO | Model Number | HN24146 |
| Place of Origin | China | Brand Name | Hiner-pack |
| High Light | durable waffle pack IC trays ，waffle pack chip trays with warranty ，contamination control IC handling trays | ||
High-Precision Cleanroom Waffle Pack IC Trays adopt dense precise grid cavity structure, meeting strict cleanroom industry standards.
With excellent contamination control & dust-proof performance, the trays provide stable safe handling, storage and transportation protection for delicate ESD-sensitive fine pitch semiconductor IC chips.
They are perfectly suitable for semiconductor manufacturing, packaging, inspection & testing processes, and support fully customized cavity size & layout designs to match various chip specifications.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×4.36 mm | ||
| Matrix QTY | 15x15=215 PCS | ||
| Service | Accept OEM, ODM | ||
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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