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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution
China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution

  1. China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution
  2. China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution
  3. China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution
  4. China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution
  5. China High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution

High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 2000PCS/Day
Delivery Time 10 workdays
Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Color Black
Quality Assurance Delivery Guarantee, Reliable Quality
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 3.00x0.70x0.30 mm
Incoterms EXW, FOB, CIF, DDU, DDP
Mold Type Injection
Reusable Yes
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Ic Type BGA,QFP,QFN,LGA,PGA
Packing Level Transport package
Warpage Warpage MAX 0.3mm
Capacity 9x19=171 PCS
Brand Name Hiner-pack
Model Number HN24136
Certification ROHS, ISO
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 2000PCS/Day
Delivery Time 10 workdays Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Color Black
Quality Assurance Delivery Guarantee, Reliable Quality Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 3.00x0.70x0.30 mm Incoterms EXW, FOB, CIF, DDU, DDP
Mold Type Injection Reusable Yes
Tray Shape Rectangular Clean Class General And Ultrasonic Cleaning
Ic Type BGA,QFP,QFN,LGA,PGA Packing Level Transport package
Warpage Warpage MAX 0.3mm Capacity 9x19=171 PCS
Brand Name Hiner-pack Model Number HN24136
Certification ROHS, ISO Place of Origin China
High Light cleanroom waffle trays for IC handlinghigh-precision waffle pack traysanti-pollution IC waffle trays
High-Precision Cleanroom Waffle Trays for Safe IC Handling & Pollution Prevention

High-Precision Cleanroom Waffle Trays meet strict cleanroom industry standards. Trays deliver excellent contamination control performance, and offer safe stable handling for delicate precision IC chips.


High-Precision Cleanroom Waffle Trays own compact precise grid structure. Trays effectively prevent dust pollution damage, and perfectly fit semiconductor manufacturing and testing processes.


High-Precision Cleanroom Waffle Trays support customized cavity designs. Trays protect fragile fine pitch chips well, and ensure stable reliable use in cleanroom logistics and storage.

Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Cleanroom-grade contamination control to protect sensitive ICs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24136
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 3.00x0.70x0.30 mm
Matrix QTY 9x19=171 PCS
Warpage

MAX 0.3mm

Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-Grade Waffle Pack Chip Trays deliver reliable IC protection through the whole semiconductor manufacturing and transportation process. Trays feature great contamination control performance, ESD anti-static protection, and fully protect delicate fine pitch chip devices.

Trays are widely applied to fine pitch IC packaging (QFN, BGA, CSP bare die), JEDEC compatible automated pick-and-place production lines, semiconductor inspection & testing procedures, as well as cleanroom IC logistics transportation and daily storage management.
Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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