Shenzhen Hiner Technology Co., Ltd.
| Mold Type | Injection |
| Payment Terms | T/T |
| Color | Usually black or dark gray for ESD protection |
| Reusable | Yes |
| Capacity | 9x7=63 PCS |
| Packaging Details | CARTON, PALLET |
| Tray Shape | Rectangular |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Clean Class | General And Ultrasonic Cleaning |
| Cavity Size | 5.0x3.35x1.20 mm |
| Warpage | Warpage MAX 0.2mm |
| Packing Level | Transport package |
| Model Number | HN24132 |
| Brand Name | Hiner-pack |
| Certification | ROHS, ISO |
| Place of Origin | China |
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Product Specification
| Mold Type | Injection | Payment Terms | T/T |
| Color | Usually black or dark gray for ESD protection | Reusable | Yes |
| Capacity | 9x7=63 PCS | Packaging Details | CARTON, PALLET |
| Tray Shape | Rectangular | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Supply Ability | 2000PCS/Day | Delivery Time | 10 workdays |
| Clean Class | General And Ultrasonic Cleaning | Cavity Size | 5.0x3.35x1.20 mm |
| Warpage | Warpage MAX 0.2mm | Packing Level | Transport package |
| Model Number | HN24132 | Brand Name | Hiner-pack |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | cleanroom-grade waffle pack trays ，IC handling contamination control trays ，waffle pack chip storage trays | ||
Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.
Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.
Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 9x7=63 PCS | ||
| Service | Accept OEM, ODM | ||
Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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