Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Color | Usually black or dark gray for ESD protection |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 3.55x1.40x0.79 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm |
| Capacity | 16x9=144 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24141 |
| Certification | ROHS, ISO |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Color | Usually black or dark gray for ESD protection | Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 3.55x1.40x0.79 mm | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection | Reusable | Yes |
| Tray Shape | Rectangular | Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA | Packing Level | Transport package |
| Warpage | Warpage MAX 0.2mm | Capacity | 16x9=144 PCS |
| Brand Name | Hiner-pack | Model Number | HN24141 |
| Certification | ROHS, ISO | Place of Origin | China |
| High Light | cleanroom waffle pack IC trays ，contamination control chip trays ，waffle pack trays for ICs | ||
Cleanroom Waffle Pack IC Trays are professional semiconductor packaging carriers designed for strict cleanroom production environments. Compliant with industry cleanroom-grade standards, these waffle pack trays provide reliable contamination control performance, and fully meet the safe handling requirements for delicate fine pitch IC chips.
Adopting standardized JEDEC grid structure, Cleanroom Waffle Pack IC Trays feature precise slot design and stable anti-pollution performance. They effectively isolate dust and particulate pollution damage, perfectly protect precision semiconductor chips from scratch and contamination during manufacturing operations.
Cleanroom Waffle Pack IC Trays deliver stable and durable chip loading performance. They are widely suitable for daily IC packaging, storage, transportation and testing workflows, keeping sensitive semiconductor chips clean, intact and stable in the whole industrial chain.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Usually black or dark gray for ESD protection | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 16x9=144 PCS | ||
| Service | Accept OEM, ODM | ||
Cleanroom-grade Waffle Pack IC chip trays provide comprehensive reliable protection for integrated circuits throughout semiconductor manufacturing, packaging, inspection, testing, transportation and storage processes.
Featuring excellent contamination control performance, the trays perfectly protect ESD-sensitive fine pitch semiconductor chip devices. They are widely applied to fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing operations, as well as daily IC logistics turnover and inventory management.
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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