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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging

  1. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
  2. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
  3. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
  4. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
  5. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging
  6. China Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 2000PCS/Day
Delivery Time 10 workdays
Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Color Black
Quality Assurance Delivery Guarantee, Reliable Quality
Cavity Size 322.6×135.9×12.19 mm
Incoterms EXW, FOB, CIF, DDU, DDP
Mold Type Injection
Reusable Yes
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Ic Type BGA,QFP,QFN,LGA,PGA
Packing Level Transport package
Flatness Less than 0.76mm
Capacity 7x12=84 PCS
Brand Name Hiner-pack
Model Number HN25001
Certification ROHS, ISO
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 2000PCS/Day
Delivery Time 10 workdays Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Color Black
Quality Assurance Delivery Guarantee, Reliable Quality Cavity Size 322.6×135.9×12.19 mm
Incoterms EXW, FOB, CIF, DDU, DDP Mold Type Injection
Reusable Yes Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning Ic Type BGA,QFP,QFN,LGA,PGA
Packing Level Transport package Flatness Less than 0.76mm
Capacity 7x12=84 PCS Brand Name Hiner-pack
Model Number HN25001 Certification ROHS, ISO
Place of Origin China
Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection
Reduce dust contamination effectively. Protect delicate semiconductor components during wafer level packaging. Offer reliable structural durability for repeated industrial use. Need stable IC tray solutions for clean production?

Fit automated semiconductor packaging lines. Adapt to wafer level processing and component handling workflows. Maintain cleanroom compatibility and consistent performance.

Support safe component storage and logistics. Offer customizable cavity layouts and sizes. Create tailored JEDEC tray designs to match unique packaging requirements.
Key Features/ Benefits 
  • Deliver durable construction.
  • Reduce dust contamination.
  • Safeguard wafer packaging processes.
  • Comply with JEDEC standards.
  • Support custom design solutions.
Specifications
Brand Hiner-pack
Model HN25001
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×12.19 mm
Cavity Size 16×9.5×4.72 mm
Matrix QTY 7x12=84 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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