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Shenzhen Hiner Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

  1. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
  2. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
  3. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
  4. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
  5. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
  6. China Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

  1. MOQ: 500 pcs
  2. Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability 2000PCS/Day
Delivery Time 10 workdays
Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Color Black
Quality Assurance Delivery Guarantee, Reliable Quality
Cavity Size 322.6×135.9×7.62 mm
Incoterms EXW, FOB, CIF, DDU, DDP
Mold Type Injection
Reusable Yes
Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning
Ic Type BGA,QFP,QFN,LGA,PGA
Packing Level Transport package
Flatness Less than 0.76mm
Capacity 7x23=161 PCS
Brand Name Hiner-pack
Model Number HN25004
Certification ROHS, ISO
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 2000PCS/Day
Delivery Time 10 workdays Packaging Details CARTON, PALLET
Tray Weight Varies, Typically Up To 500 Grams Per Cavity Color Black
Quality Assurance Delivery Guarantee, Reliable Quality Cavity Size 322.6×135.9×7.62 mm
Incoterms EXW, FOB, CIF, DDU, DDP Mold Type Injection
Reusable Yes Tray Shape Rectangular
Clean Class General And Ultrasonic Cleaning Ic Type BGA,QFP,QFN,LGA,PGA
Packing Level Transport package Flatness Less than 0.76mm
Capacity 7x23=161 PCS Brand Name Hiner-pack
Model Number HN25004 Certification ROHS, ISO
Place of Origin China
Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term industrial use. Searching for dependable tray solutions for semiconductor production?

Fit high-standard manufacturing environments and automated production lines. Ensure stable performance during wafer handling and transfer processes. Adapt to various semiconductor packaging procedures smoothly.

Support safe storage and transportation of wafers. Accept customized sizes and structures to meet different production needs. Provide tailored solutions for diverse semiconductor packaging requirements.
Key Features/ Benefits 
  • Strong durable structure
  • Stable wafer protection
  • Safeguard wafer packaging processes
  • Comply with JEDEC standards
  • Flexible customization
Specifications
BrandHiner-pack
ModelHN25004
Material MPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×7.62 mm
Cavity Size13×7.5×7.62 mm
Matrix QTY7x23=161 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Widely used in semiconductor wafer packaging, chip testing, die sorting and device manufacturing. Suitable for cleanroom production, automated assembly lines and high-precision processing workshops. Perfectly match various wafer level packaging processes and ensure stable performance in strict production environments.

Also applied to wafer storage, factory logistics, production turnover and sample delivery. Meet requirements of semiconductor packaging plants, testing centers and electronic component manufacturers. Support safe and efficient operation of the whole semiconductor production and supply chain.
Customized Services
Provide professional customized services for JEDEC IC trays according to customer needs. Support personalized design of cavity size, arrangement and material. Create exclusive tray structures for different wafers and packaging processes. Offer one-stop tailored solutions to improve production efficiency and meet special application requirements in semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co., Ltd.
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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