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{"title":"JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD","imgUrl":"https:\/\/img.chinax.com\/nimg\/23\/7e\/8ea2535e8c50bb59af8c84387bab-200x200-1\/jedec_standard_lga_ic_semiconductor_tray_hips_materials_non_esd.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1979","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
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{"title":"Customized Black ESD JEDEC IC Trays Ultrasonic Cleaning For PCBA Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/98\/13\/82c18523750281362c4b3876b4d7-200x200-1\/customized_black_esd_jedec_ic_trays_ultrasonic_cleaning_for_pcba_module.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN18102","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"Antistatic PPE Standard JEDEC ESD Protect Module Tray","imgUrl":"https:\/\/img.chinax.com\/nimg\/58\/4a\/6d869695bc67abee749b7bc79c7e-200x200-1\/antistatic_ppe_standard_jedec_esd_protect_module_tray.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1984","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
{"title":"High Temperature Resistance PPO JEDEC IC Trays Durable ESD","imgUrl":"https:\/\/img.chinax.com\/nimg\/09\/46\/faf87a26d6178b473e601f3fc297-200x200-1\/high_temperature_resistance_ppo_jedec_ic_trays_durable_esd.jpg","attrs":{"Brand Name":"Hiner-pack","Model Number":"HN1858","Certification":"ISO 9001 ROHS SGS","Place of Origin":"Made In China"}}
Clean Production JEDEC IC Trays for Wafer Protection
Shield delicate semiconductor wafers from dust and damage during production and handling. Maintain clean production environment effectively. Built with sturdy structure to meet JEDEC standards for long-term industrial use. Looking for reliable tray solutions for wafer protection?
Fit automated assembly lines and packaging plants perfectly. Perform steadily in wafer transfer and packaging procedures. Adapt to diverse semiconductor manufacturing processes smoothly.
Enable safe wafer storage and factory logistics. Support custom designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits
Strong durable structure
Effective dust prevention
Safeguard wafer packaging processes
Clean production support
Flexible customization
Specifications
Brand
Hiner-pack
Model
HN25012
Material
MPPO
Package Type
JEDEC
Color
Black
Resistance
1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size
322.6×135.9×7.62 mm
Cavity Size
4×4×0.75 mm
Matrix QTY
11X26=286 PCS
Warpage
MAX 0.74mm
Service
Accept OEM, ODM
Custom Pocket Options
Available
Applications
Serve semiconductor front-end processing, wafer probing, final assembly, and device testing operations. Adapt to cleanroom Class 100/1000 environments, automated material handling systems, and high-temperature manufacturing processes.
Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, foundries, and outsourced semiconductor assembly and test facilities.
Customized Services
Offer end-to-end customization for JEDEC IC trays. Collaborate with engineering teams to define cavity pitch, pocket depth, and material properties for specific wafer sizes and thicknesses. Develop anti-static or high-temperature resistant variants, and validate prototypes through in-house testing. Deliver fully tailored tray solutions that optimize production flow and minimize contamination risks for advanced semiconductor manufacturing.
About Us: Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-p...