Shenzhen Hiner Technology Co., Ltd.
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays |
| Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity |
| Color | Usually black or dark gray for ESD protection |
| Quality Assurance | Delivery Guarantee, Reliable Quality |
| Cavity Size | 30x22x2.3 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Mold Type | Injection |
| Reusable | Yes |
| Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning |
| Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package |
| Flatness | Less than 0.76mm |
| Capacity | 5x9=45 PCS |
| Brand Name | Hiner-pack |
| Model Number | HN24237 |
| Certification | ROHS, ISO |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Delivery Time | 10 workdays | Packaging Details | CARTON, PALLET |
| Tray Weight | Varies, Typically Up To 500 Grams Per Cavity | Color | Usually black or dark gray for ESD protection |
| Quality Assurance | Delivery Guarantee, Reliable Quality | Cavity Size | 30x22x2.3 mm |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Mold Type | Injection |
| Reusable | Yes | Tray Shape | Rectangular |
| Clean Class | General And Ultrasonic Cleaning | Ic Type | BGA,QFP,QFN,LGA,PGA |
| Packing Level | Transport package | Flatness | Less than 0.76mm |
| Capacity | 5x9=45 PCS | Brand Name | Hiner-pack |
| Model Number | HN24237 | Certification | ROHS, ISO |
| Place of Origin | China | ||
| High Light | JEDEC reusable semiconductor tray ，IC tray for semiconductor logistics ，JEDEC IC tray with warranty | ||
Our reusable JEDEC trays are engineered for secure semiconductor IC transport and long-term storage, delivering a cost-effective solution to reduce packaging waste and operational costs. Made with durable ESD-safe materials, these trays provide reliable electrostatic discharge protection for sensitive ICs, BGA packages and electronic components, ensuring zero damage during logistics, warehousing and repeated use.
Fully compliant with JEDEC industry standards, these trays maintain exceptional dimensional stability and precise chip pocket positioning, ensuring seamless compatibility with automated handling equipment, pick-and-place machines, and testing systems. The standardized footprint and tight tolerances guarantee error-free chip alignment and stable automated operations, preventing misplacement or damage during production and assembly. Whether you need trays for global IC shipping, component warehousing, or in-house production line use, these reusable JEDEC trays offer a reliable, long-lasting solution that balances performance, cost efficiency, and universal compatibility for semiconductor logistics and storage.
| Brand | Hiner-pack | ||
| Material | ABS | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 5x9=45 PCS | ||
| Service | Accept OEM, ODM | ||
Why Choose Us:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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